Chemical-mechanical polishing (CMP) process of STI and DTI- Ching-Yu Hsieh

Lee, Shih-Ping; Tseng, Tzu-Hsuan; Chuang, Chih-Hao; Chuang, C.-L.; Cheng, Cheng-Hung; Tung, Hsin-Ying; Huang, Pin-Chieh; Chou, Chung-Tien

doi:10.23919/emdc/issm48219.2019.9052083

2019 Joint International Symposium on E-Manufacturing &Amp; Design Collaboration(eMDC) &Amp; Semiconductor Manufacturing (ISSM) 2019

DOI: 10.23919/emdc/issm48219.2019.9052083

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Chemical-mechanical polishing (CMP) process of STI and DTI- Ching-Yu Hsieh

Shih-Ping Lee

Tzu-Hsuan Tseng

Chih-Hao Chuang

et al.

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Chemical-mechanical polishing (CMP) process of STI and DTI- Ching-Yu Hsieh

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