Chemical mechanical polishing characteristics of ITO thin film prepared by RF magnetron sputtering

Lee, Kang-Yeon; Choi, Gwon-Woo; Kim, Yong-Jae; Choi, Youn-Ok; Kim, Nam-Oh

doi:10.3938/jkps.60.388

Cited by 5 publications

(2 citation statements)

References 21 publications

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“…Lee utilized the high-frequency magnetron sputtering method to cultivate the ITO thin film on a glass substrate. This technique yielded optimal conditions of high removal rate, low resistivity, and high transmittance using the chemical mechanical polishing process [20]. Additionally, Lee and Gupta's research indicated that CMP resulted in increased surface uniformity and improved transmittance of ITO thin films [21,22].…”

Section: Introductionmentioning

confidence: 97%

Analysis of Surface Roughness during Surface Polishing of ITO Thin Film Using Acoustic Emission Sensor Monitoring

Kim,

Lee,

Lee

2023

Coatings

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This study investigates the intricate process of surface polishing for ITO-coated Pyrex glass utilizing magnetic abrasive polishing (MAP) while employing acoustic emission (AE) sensors for real-time defect monitoring. MAP, known for its versatility in achieving nanoscale thickness processing and uniform surfaces, has been widely used in various materials. However, the complexity of the process, influenced by multiple variables like cutting conditions, material properties, and environmental factors, poses challenges to maintaining high surface quality. To address this, a sensor monitoring system, specifically one that uses AE sensors, was integrated into the MAP process to detect and confirm defects, providing real-time insights into machining conditions and outcomes. AE sensors excel in identifying material deterioration, microcrack formation, and wear, even in cases of minor damage. Leveraging AE sensor data, this study aims to minimize surface defects in ITO thin films during MAP while optimizing surface roughness. The investigation involves theoretical validation, magnetic density simulations, and force sensor pressure measurements to identify factors influencing surface roughness. ANOVA analysis is employed to determine optimal processing conditions. Additionally, this study compares the identified optimal roughness conditions with those predicted by AE sensor parameters, aiming to establish a correlation between predicted and achieved surface quality. The integration of AE sensor monitoring within the MAP process offers a promising avenue for enhancing surface quality by effectively identifying and addressing defects in real time. This comprehensive analysis contributes to advancing the understanding of surface polishing methodologies for ITO-coated Pyrex glass, paving the way for improved precision and quality in thin-film surface processes.

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Section: Introductionmentioning

confidence: 97%

Analysis of Surface Roughness during Surface Polishing of ITO Thin Film Using Acoustic Emission Sensor Monitoring

Kim,

Lee,

Lee

2023

Coatings

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“…Increasing the internal compressive stress will improve the hardness of the ITO thin film. Lee et al [24] compared chemical mechanical polishing with different process parameters to improve the surface quality of ITO films, and compared the electrical and optical properties of the polished ITO films. The optimal processing conditions with high removal rate, low non-uniformity, low resistivity, and high transmittance were obtained.…”

Section: Introductionmentioning

confidence: 99%

Experimental investigations into the effect of process parameters on the machining quality for ITO conductive glass using by micro grooves grinding

Liu,

Qiu,

Sun

et al. 2023

Preprint

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To investigate the effect of micro-scale grinding on the quality of ITO conductive glass, this paper conducted micro-scale grinding experiments on ITO conductive glass. The influence of process parameters on machining quality was analyzed using micro-grinding force, surface roughness, and sheet resistance as indicators. Meanwhile, soda-lime glass was set as the control group to analyze the effect of ITO film. The results indicate that brittle fracture is the main removal method for ITO films, and the glass substrate exhibits two different removal methods, brittle and ductile, depending on the process parameters. The ITO thin film layer suppresses the sheet deformation of the glass substrate, increasing the grinding force and reducing the processing quality. Increasing the spindle speed, reducing the feed speed, and reducing the cutting depth can improve the machining quality. The spindle speed has a significant impact on surface roughness, while the cutting depth has a significant impact on the sheet resistance of the thin film. In addition, soda-lime glass chips mainly appear in powder and granular form, while ITO conductive glass also has flaky thin film chips generated by interlayer fracture.

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Experimental investigations into the effect of process parameters on the machining quality for ITO conductive glass by using microgroove grinding

Liu,

Qiu,

Sun

et al. 2024

Int J Adv Manuf Technol

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Chemical mechanical polishing characteristics of ITO thin film prepared by RF magnetron sputtering

Cited by 5 publications

References 21 publications

Analysis of Surface Roughness during Surface Polishing of ITO Thin Film Using Acoustic Emission Sensor Monitoring

Analysis of Surface Roughness during Surface Polishing of ITO Thin Film Using Acoustic Emission Sensor Monitoring

Experimental investigations into the effect of process parameters on the machining quality for ITO conductive glass using by micro grooves grinding

Experimental investigations into the effect of process parameters on the machining quality for ITO conductive glass by using microgroove grinding

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