Chemical Mechanical Planarization-Related to Contaminants: Their Sources and Characteristics

Abstract

Chemical mechanical planarization (CMP) process has been widely used to planarize a variety of materials including dielectrics, metal, and semiconductors in Si-based semiconductor devices. It is one of the most critical steps to achieve the nanolevel wafer and die scale planarity. However, various contaminants are observed on the wafer surfaces after the CMP process, and they become the most critical yield detractor over many generations of rapidly diminishing feature sizes because they have the most direct impacts on device performance and reliability. This book chapter provides (1) CMP consumables-induced contaminants such as residual particles, surface residues, organic residues, pad debris and metallic impurities, pad contamination, watermark, etc., (2) brush-induced cross-contamination during post CMP cleaning, (3) post-CMP cleaning for removing these contaminants. Fundamental understanding of the formation of various types of CMP contaminants and their characteristics will significantly benefit the development of next-generation CMP slurries and post-CMP cleaning solutions.

Review—Post-Chemical Mechanical Planarization Cleaning Technology

“…The chemical mechanical planarization process (CMP) is an integral step for the successful fabrication of integrated circuits (IC) in the current manufacturing process with a feature size of 10 nm or less 1,2 and thus become a key enabler for this technology. The CMP process synergistically incorporates chemical and mechanical action to remove excess material from the wafer surface after being deposited.…”