Chemical durability of polyimide blend films

Niyogi, Sobhan; Maiti, Sukumar; Adhikari, Basudam

doi:10.1016/s0141-3910(00)00037-9

Cited by 11 publications

(2 citation statements)

References 34 publications

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“…Chemical resistances were evaluated by weight losses or gains of the cured resin specimens (15 × 15 × 3 mm) immersed in various solvents at 25 °C 14. The solvents employed included 50% H 2 SO 4 aqueous solution, 36% HCl aqueous solution, 40% NaOH aqueous solution, 4% KMnO 4 aqueous solution, saturated NaCl aqueous solution, distilled water, ethanol and N ‐methyl‐2‐pyrrolidinone.…”

Section: Methodsmentioning

confidence: 99%

Preparation and characterization of unsaturated poly(ester‐imide) based on 1,4‐bis[2′‐trifluoromethyl‐4′‐(4″‐glycolformate)‐trimellitimidophenoxy]benzene

Wang

Fan

et al. 2006

Polymer International

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A novel diimidodialcohol monomer, 1,4‐bis[2′‐trifluoromethyl‐4′‐(4″‐glycolformate)‐ trimellitimidophenoxy]benzene (BGTB), was synthesized and characterized. It was reacted with isophthalic acid, maleic anhydride and propylene glycol to produce a novel unsaturated poly(ester‐imide) (BGTB‐UPEI) with imide and trifluoromethyl groups in the polymer backbone. The BGTB‐UPEI resin was diluted with reactive monomer (styrene) to give a low‐viscous poly(ester‐imide)/styrene (BGTB‐UPEI/St) mixed solution, which was then thermally cured to yield thermosetting BGTB‐UPEI/St composite. The effect of processing parameters such as the curing temperature and curing time, reactive monomer concentration and initiator amount on the curing reaction was systematically investigated. Experimental results indicated that the thermally cured BGTB‐UPEI/St composite exhibited much better thermal, mechanical, electrical insulating properties and chemical resistance than the standard unsaturated polyester/polystyrene composite. Copyright © 2006 Society of Chemical Industry

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Section: Methodsmentioning

confidence: 99%

Preparation and characterization of unsaturated poly(ester‐imide) based on 1,4‐bis[2′‐trifluoromethyl‐4′‐(4″‐glycolformate)‐trimellitimidophenoxy]benzene

Wang

Fan

et al. 2006

Polymer International

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“…PI is known as a high-performance material due to its excellent chemical, thermal, mechanical, and electrical properties, exceptional thermooxidation and, radiation resistance, superior adhesion properties, and solvent resistance. [46][47][48] The applications for PIs are in composites, nanocomposite, aerospace, electroluminescent devices, gas separation membranes, polymer electrolyte fuel cell membranes, nanofiltration membranes, chemical sensors, fiber optics, to name a few. 49,50 Incorporating ND particles in high-performance PI may impart remarkable properties to their nanocomposites, like other nanoparticle filled PIs used in coatings, adhesives, and fibers in aerospace, electronics, and other highly technical industries.…”

Section: Pi/nd Nanocompositesmentioning

confidence: 99%

Nanodiamond reinforcement in polyamide and polyimide matrices: Fundamentals and applications

Kausar

2018

Journal of Plastic Film & Sheeting

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Nanodiamond is an emerging nanocarbon material having several advantageous properties (high surface area, mechanical properties, optical features, wear resistance, low friction coefficient, etc.) as a nano-sized filler for polymer matrices. Polyamides and polyimides are two important thermoplastic polymers which are among important matrices for nanodiamond composites. Polyamides have high thermal stability, mechanical strength, wear resistance, superior tribological properties, and fine processability. Many aliphatic polyamides, such as polyamide 6, polyamide 6,6, polyamide11, polyamide 12, and several aromatic polyamides have been reinforced with nanodiamond to further enhance their engineering properties. Similarly, outstanding mechanical, thermal, optical, and electrical properties of aromatic polyimides have been enhanced by using nanodiamond particles. Surface nanodiamond modification with various functional groups has been achieved to enhance interfacial adhesion with the matrix, which in turn, improved the physical properties. Polyamide/nanodiamond nanocomposites and polyimide/nanodiamond nanocomposites have been prepared using in situ reactive polymerization, melt extrusion, solution processing, and other techniques. The improved electrical, mechanical, thermal, and biomedical properties render them potentially important materials for various technical applications including energy storage, membrane technology, coatings, and biomedical.

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Hydrothermal aging of polyimide film

Braun

Nam

Mata

et al. 2022

J of Applied Polymer Sci

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The hydrothermal aging of a commercial polyimide film, (poly[pyromellitic dianhydride‐co‐4,4′‐oxydianiline]) is investigated, providing further insight into the well‐known loss of properties that can occur for these materials in the presence of moisture. The study involved measuring ATR‐FTIR, ultimate tensile strength, and percent elongation at break, under accelerated hydrothermal aging conditions at three different temperatures (70, 80, and 90°C). ATR‐FTIR data was analyzed using chemometrics in order to identify significant trends that develop upon the accelerated aging conditions. The most dramatic changes were observed for the aging at 90°C. Changes in the ATR‐FTIR spectra for aging at all three temperatures can be attributed to hydrolysis of the imide groups. Ultimate tensile strength was also used to monitor the hydrothermal aging process. This data was used to construct an Arrhenius plot from which an activation energy of 71.8 KJ/mol was determined for the hydrothermal aging process. This value is comparable to that of textiles used in fire protective clothing, suggesting that polyimide is a viable candidate for modeling the degradation of these textiles. This paper also shows the large potential of chemometrics for polymer aging studies as it allows identifying degradation mechanisms from subtle chemical changes in the materials.

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Chemical durability of polyimide blend films

Cited by 11 publications

References 34 publications

Preparation and characterization of unsaturated poly(ester‐imide) based on 1,4‐bis[2′‐trifluoromethyl‐4′‐(4″‐glycolformate)‐trimellitimidophenoxy]benzene

Preparation and characterization of unsaturated poly(ester‐imide) based on 1,4‐bis[2′‐trifluoromethyl‐4′‐(4″‐glycolformate)‐trimellitimidophenoxy]benzene

Nanodiamond reinforcement in polyamide and polyimide matrices: Fundamentals and applications

Hydrothermal aging of polyimide film

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