2007 IEEE International Integrated Reliability Workshop Final Report 2007
DOI: 10.1109/irws.2007.4469219
|View full text |Cite
|
Sign up to set email alerts
|

Charge-gain program disturb mechanism in split-gate flash memory cell

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
4

Citation Types

0
5
0

Year Published

2013
2013
2024
2024

Publication Types

Select...
6
2

Relationship

0
8

Authors

Journals

citations
Cited by 9 publications
(5 citation statements)
references
References 8 publications
0
5
0
Order By: Relevance
“…The embedded SuperFlash (ESF) memory was introduced in high-volume production in the 90s by SST ® (ESF1) [4] as a stored charge-based memory technology alternative to the conventional floating gate (FG) one. ESF technology exhibits high injection efficiency, fast operations, over-erase immunity and improved reliability [5][6][7]. To achieve both short time-to-program (T2P) and high injection efficiency (η), ESF cells programing is based on the source side injection (SSI) mechanism [8][9][10].…”
Section: Introductionmentioning
confidence: 99%
“…The embedded SuperFlash (ESF) memory was introduced in high-volume production in the 90s by SST ® (ESF1) [4] as a stored charge-based memory technology alternative to the conventional floating gate (FG) one. ESF technology exhibits high injection efficiency, fast operations, over-erase immunity and improved reliability [5][6][7]. To achieve both short time-to-program (T2P) and high injection efficiency (η), ESF cells programing is based on the source side injection (SSI) mechanism [8][9][10].…”
Section: Introductionmentioning
confidence: 99%
“…[10][11][12][13][14] To meet its customized requirement, such as those for mobile or automotive application, the optimization of processes has been extensively discussed. [15][16][17][18][19][20][21][22][23][24][25] Recently, the development of the split gate has focused on a 3-poly structure, which has the advantages of low power and high coupling ratio. [25][26][27][28][29][30][31] By applying high voltage on an additional-assistance 3-poly gate, these sidewall split gate flashes can have a high coupling ratio and a low junction leakage as well.…”
Section: Introductionmentioning
confidence: 99%
“…This induces possible tail bit failure in memory arrays. 20) In this study, we propose a novel split gate flash cell consisting of a pair of floating gates with a symmetric arrangement in structure. This symmetric structure of the unit cell enable our cell to be easily arranged as a high-density AND-type array.…”
Section: Introductionmentioning
confidence: 99%
See 1 more Smart Citation
“…The second concern comes from the program disturb effects in conventional AND-type virtual ground configuration. During programming operation, cells belonging to the same selected buried diffusion BL pair and CG pair as the selected cell are only deselected by SG bias and would suffer serious punchthrough (PT) [12] and reverse-tunneling (RT) disturb effects [13].…”
mentioning
confidence: 99%