Characterterization of Multi-Scale Nanosilver Paste Reinforced with SIC Particles

Jiang, Zhiyong; Sun, Yuguang; Zhang, Qiaoran; Lv, Zhen; Wu, Yanpei; Xi, Weijuan; Zhou, Cheng; Chen, Shujing; Zhang, Maomao; Liu, Johan; Lu, Xiuzhen

doi:10.1109/cstic49141.2020.9282590

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2022

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“…The power density is increasing with the development of packaging integration of electronic devices, which will lead to more heat accumulation in electronic products [1]. Traditional interconnection materials cannot meet the requirements of high operating temperature for high power density devices [2].…”

Section: Introductionmentioning

confidence: 99%

Reduction of thermal resistance of Ag-coated GFs/copper structure using nano-Ag paste as interconnection

Zhou

Liu

et al. 2022

J. Phys.: Conf. Ser.

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Reduction of the thermal resistance between graphene films (GFs) and substrate is crucial to the application of GFs in thermal management. GFs/copper structures were prepared using nano-Ag paste as interconnection material. The effect of the thickness of nano-Ag paste on thermal resistance of GFs/copper structure was investigated. A thin layer of Ag was coated on GFs by physical vapor deposition (PVD) to further reduce thermal resistance. The thermal resistance of GFs/copper structure using Ag-coated GFs is 5.84% lower than that using raw GFs. The thermal resistance of GFs/copper structure decreases first and then increases with the increase of coating temperature and thickness of Ag layer. The minimum thermal resistance of 1.64 mm2·K·W−1 was gained for GFs/copper structure using GFs coated Ag at 300 °C for 60 min.

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Section: Introductionmentioning

confidence: 99%