Characterizing the TEM Cell Electric and Magnetic Field Coupling to PCB Transmission Lines

Mandic, Tvrtko; Gillon, Renaud; Nauwelaers, Bart; Barić, Adrijan

doi:10.1109/temc.2012.2193888

Cited by 34 publications

(9 citation statements)

References 17 publications

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“…The setup consists of two PCBs (the backplane and the characterization board). Addi-tionally, two calibration structures are designed to extract the relative permittivity of the PCB substrate and to optimize the parameters of the model of the subminiature version A (SMA) connectors [21]. Knowing the characteristics of the substrate and that of the SMA connectors allows generation of the model of the complete setup and its comparison to the measurements.…”

Section: Model Of the Characterization Setupmentioning

confidence: 99%

Multisegment Multiconductor Transmission Line Model of High-Current Card-Edge Connectors With Analytically Calculated Model Parameters

Blecic

Bako

Gillon

et al. 2019

IEEE Trans. Electromagn. Compat.

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Modeling of two high-current card-edge connectors is presented. The modeling methodology consists of dividing the connectors into uniform segments and modeling each segment by a multiconductor transmission line. The calculation of the per-unit-length parameters of each segment is based on the analytic expression for a generalized capacitance matrix of widely sepa-rated conductors. The proposed modeling methodology generates the circuit model solely from the geometrical parameters of the con-nectors without the need to perform measurements and/or electro-magnetic simulations. The modeling methodology is applied to two 62-pin high-current card-edge connectors that are used in the mea-surement setup for characterization of radiated electromagnetic emission of switched-mode power converters. Two printed circuit boards are designed to characterize the connectors and to vali-date the modeling methodology. The model of the complete char-acterization setup shows good agreement with the Sparameter measurements up to 3 GHz.

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Section: Model Of the Characterization Setupmentioning

confidence: 99%

Multisegment Multiconductor Transmission Line Model of High-Current Card-Edge Connectors With Analytically Calculated Model Parameters

Blecic

Bako

Gillon

et al. 2019

IEEE Trans. Electromagn. Compat.

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“…With coupled lines theory, Mandić predicted the coupling between a TEM cell septum and PCB traces [6] with a circuit simulator. His model is not transparent, nor is it weakly coupled.…”

Section: State Of the Artmentioning

confidence: 99%

Simple, Taylor-Based Worst-Case Model for Field-to-Line Coupling

Land¹,

Ramdani²,

Perdriau³

et al. 2013

PIER

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Abstract-To obtain Electromagnetic Compatibility (EMC), we would like to study the worst-case electromagnetic field-induced voltages at the ends of Printed Circuit Board (PCB) traces. With increasing frequencies, modelling these traces as electrically short no longer suffices. Accurate long line models exist, but are too complicated to easily induce the worst case. Therefore, we need a simple analytical model. In this article, we predict the terminal voltages of an electrically long, two-wire transmission line with characteristic loads in vacuum, excited by a linearly polarised plane wave. The model consists of a short line model (one Taylor cell) with an intuitive correction factor for long line effects: the modified Taylor cell. We then adapt the model to the case of a PCB trace above a ground plane, illuminated by a grazing, vertically polarised wave. For this case, we prove that end-fire illumination constitutes the worst case. We derive the worst-case envelope and try to falsify it by measurement in a Gigahertz Transverse Electromagnetic (GTEM) cell.

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“…The variation of the septum length l S with respect to the length of the cavity l C affects the length of the tapers. The shape of the tapers has a significant impact on the VSWR performance [12]. The height h C of the cavity as well as the width of the cavity w C and septum w S have a direct impact on the IC-Stripline characteristic impedance and consequently on the VSWR.…”

Section: A Experiments Set-upmentioning

confidence: 99%

IC-Stripline design optimization using response surface methodology

Mandic

Gillon

Barić

2013

2013 9th International Workshop on Electromagnetic Compatibility of Integrated Circuits (EMC Compo)

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This paper presents design optimization of closed version of an IC-Stripline. The geometrical parameters of the ICStripline are optimized in order to improve VSWR performance in the frequency range up to 6 GHz. Since the optimization performed directly in 3D EM simulator is computationally expensive, the response surface methodology (RSM) based on design of experiment (DOE) is used to develop surrogate models and to accelerate IC-Stripline design optimization. The design of experiment approach is used to systematically vary geometrical parameters of the IC-Stripline structure which are then simulated in a 3D electromagnetic simulator. The equivalent model circuit parameters are extracted according to the 3D EM simulation results. The response surface formed by the extracted parameter values is modelled using a higher order polynomial. The VSWR optimization of the IC-Stripline is performed by optimizing the equivalent circuit model having the parameters defined by the response surface models. The proposed design of the ICStripline shows the improvement in VSWR performance over the frequency range up to 6 GHz.

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Characterizing the TEM Cell Electric and Magnetic Field Coupling to PCB Transmission Lines

Cited by 34 publications

References 17 publications

Multisegment Multiconductor Transmission Line Model of High-Current Card-Edge Connectors With Analytically Calculated Model Parameters

Multisegment Multiconductor Transmission Line Model of High-Current Card-Edge Connectors With Analytically Calculated Model Parameters

Simple, Taylor-Based Worst-Case Model for Field-to-Line Coupling

IC-Stripline design optimization using response surface methodology

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