Characterizations of Metal-based Thermal Interface Materials (TIM) in a Singulated Flip Chip Ball Grid Array Package

Hsieh, Ming-Che; Huang, Pu-Shan; Chen, Chi-Yuan; Lin, Stanley; Choi, JoonYoung; Kim, YoungCheol; Kim, WooSoon

doi:10.1109/estc60143.2024.10712026

2024 IEEE 10th Electronics System-Integration Technology Conference (ESTC) 2024

DOI: 10.1109/estc60143.2024.10712026

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Characterizations of Metal-based Thermal Interface Materials (TIM) in a Singulated Flip Chip Ball Grid Array Package

Ming-Che Hsieh,

Pu-Shan Huang,

Chi-Yuan Chen

et al.

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Characterizations of Metal-based Thermal Interface Materials (TIM) in a Singulated Flip Chip Ball Grid Array Package

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References 6 publications

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