Characterization on the thermal field inside IGBT cells during switching based on TCAD modeling and Thermoreflectance imaging

Ma, Xiao; Huang, Yongle; Xiao, Fei; Luo, Yifei; Han, Tongyao

doi:10.1016/j.mejo.2023.106016

Microelectronics Journal

2023

DOI: 10.1016/j.mejo.2023.106016

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Characterization on the thermal field inside IGBT cells during switching based on TCAD modeling and Thermoreflectance imaging

Xiao Ma,

Yongle Huang,

Fei Xiao

et al.

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Characterization on the thermal field inside IGBT cells during switching based on TCAD modeling and Thermoreflectance imaging

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References 16 publications

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