Characterization of transfer molding effects on RF performance of power amplifier module

Li, L.; Kapur, Ashok; Heames, K.B.

doi:10.1109/ectc.2004.1320340

Cited by 7 publications

(2 citation statements)

References 4 publications

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“…The printing of an IC die encapsulation using the above outlined SLA materials is presented with the goal of replacing standard epoxy molding and stamping methods of package encapsulation [13]. In addition to being an ambient-pressure room-temperature fabrication process, SLA printing allows for the realization of selectivelypatterned and nontraditionally-shaped encapsulation solutions, while simultaneously maintaining tan δ within the same range of standard epoxy molding compound materials [14].…”

Section: D-printed Ic Encapsulationmentioning

confidence: 99%

Inkjet and 3D Printing Technology for Fundamental Millimeter-Wave Wireless Packaging

Tehrani

Bahr

Tentzeris

2017

International Symposium on Microelectronics

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This paper outlines the design, processing, and implementation of inkjet and 3D printing technologies for the development of fully-printed, highly-integrated millimeter-wave (mm-wave) wireless packages. The materials, tools, and processes of each technology are outlined and justified for their respective purposes. Inkjet-printed 3D interconnects directly interfacing a packaging substrate with an IC die are presented using printed dielectric ramps and coplanar waveguide (CPW) transmission lines exhibiting low loss (0.6–0.8 dB/mm at 40 GHz). Stereolithography (SLA) 3D printing is presented for the encapsulation of IC dies, enabling the application-specific integration of on-package structures, including dielectric lenses and frequency selective surface (FSS)-based wireless filters. Finally, inkjet and 3D printing technology are combined to present sloped mm-wave interconnects through an encapsulation, or through-mold vias (TMVs), achieving a slope up to 65° and low loss (0.5–0.6 dB/mm at 60 GHz). The combination of these additive techniques is highlighted for the development of scalable, application-specific wireless packages.

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Section: D-printed Ic Encapsulationmentioning

confidence: 99%

Inkjet and 3D Printing Technology for Fundamental Millimeter-Wave Wireless Packaging

Tehrani

Bahr

Tentzeris

2017

International Symposium on Microelectronics

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“…The discrete components can also be buried into the organic substrate for process simplicity. Recently, some advanced PCB technologies have offered embedded passives for low-GHz RF applications, such as a Bluetooth transceiver module, power amplifier module or sensors (Li L. et al, 2003;Li L. et al, 2004;Vatanparast R. et al, 2007).…”

Section: Resistormentioning

confidence: 99%

Advanced Microwave Circuits and Systems

Zhurbenko

2010

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RF LDMOS Transistor Plastic Immunity Enhancement in Power Amplifier Module for 5G Applications

Shilimkar

Kim

2021

2021 IEEE BiCMOS and Compound Semiconductor Integrated Circuits and Technology Symposium (BCICTS)

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Characterization of transfer molding effects on RF performance of power amplifier module

Cited by 7 publications

References 4 publications

Inkjet and 3D Printing Technology for Fundamental Millimeter-Wave Wireless Packaging

Inkjet and 3D Printing Technology for Fundamental Millimeter-Wave Wireless Packaging

Advanced Microwave Circuits and Systems

RF LDMOS Transistor Plastic Immunity Enhancement in Power Amplifier Module for 5G Applications

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