Characterization of thermally stable compliant structures with internal fluidic channels

Chun, Heebum; Kim, Gyu Ha; Villarraga-Gómez, Herminso; Kim, Hyo‐Young; Elwany, Alaa; Lee, ChaBum

doi:10.1016/j.precisioneng.2020.07.013

Cited by 5 publications

(2 citation statements)

References 22 publications

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“…In recent years, concepts similar to thermal deformation self-elimination have mostly appeared in the field of precision equipment [19][20][21][22], and optics [23][24][25]. In precision equipment, Lee presented an air-bearing stage that utilizes a four-bar linkage flexure to compensate for yaw motion while maintaining both the high structural stiffness of the stage and the extremely low rotational stiffness of the flexure [19].…”

Section: Introductionmentioning

confidence: 99%

“…They were the first to propose applying the principle of thermal deformation self-elimination to nanopositioners. Chun presented a novel approach to mitigate the thermal effects in flexure mechanism-based nanopositioning systems by introducing fluid flow (air or water) through the internal fluidic channels of the compliant structure [21]. Wang provided a new design strategy for the sandwiched metastructure with zero thermal-induced warping, high load-bearing capability, and high resonant frequency, exhibiting a negligible outof-plane thermal-induced warping, reduced by 99.8% [22].…”

Section: Introductionmentioning

confidence: 99%

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A Novel Thermal Deformation Self-Stabilization Flexible Connection Mechanism

Feng,

Lin,

Tang

2024

Actuators

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In micro-LED chip repair, a nanopositioner is commonly used to adjust the positioning of the LED chip. However, during the bonding process, the heat generated can cause the positioning system to deform, leading to inaccurate alignment and poor-quality chip repair. To solve this issue, a novel flexible connection structure has been proposed that can eliminate thermal deformation. The principle of this novel flexible connection structure is that the thermal distortion self-elimination performance is achieved via three flexible connection modules (FCM) so that the thermal stress is automatically eliminated. First, the paper introduces the principle of thermal deformation elimination, and then the design and modeling process of the proposed structure are described. A heat transfer model is then developed to determine how temperature is distributed within the structure. A thermal deformation model is established, and the size of the FCM is optimized using a genetic algorithm (GA) to minimize the thermal deformation. Finite element analysis (FEA) is used to simulate and evaluate the thermal distortion self-elimination performance of the optimized mechanism. Finally, experiments are conducted to verify the reliability and accuracy of the simulation results. The simulations and experiments show that the proposed structure can eliminate more than 38% of the thermal deformation, indicating an excellent thermal deformation self-eliminating capability.

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Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

A Novel Thermal Deformation Self-Stabilization Flexible Connection Mechanism

Feng,

Lin,

Tang

2024

Actuators

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On the applications of additive manufacturing in semiconductor manufacturing equipment

Ye,

El Desouky,

Elwany

2024

Journal of Manufacturing Processes

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A monolithic linear motion platform driven by a piezoelectric and fluidic pressure-fed dual mechanism

Chun

Kim

Lee

et al. 2021

Review of Scientific Instruments

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This paper presents a novel dual-mode motion mechanism capable of achieving nanopositioning on a monolithic linear motion platform. Unlike conventional dual-mode stages that use piezoelectric (PZT)- and electromagnetic-combined or similar actuation mechanisms comprising two separate motion axes, the dual-mode actuation was developed by combining a PZT for a coarse motion and a fluidic pressure-fed mechanism (FPFM) for a fine motion and was implemented in a monolithic flexure stage fabricated by metal additive manufacturing. The FPFM actuates the flexure stage by pressuring the media in the fluidic channels created inside the flexure spring structures. Experimental tests were performed to investigate the performance of the dual-mode linear motion platform. The stiffness, damping, and frequency response functions of the dual-mode stage were experimentally characterized. The proportional–integral–differential control combined with dual-mode control was employed to control the position of the flexure stage while bidirectionally controlling the flow of compressed air for a fine motion. The FPFM motion showed a good response to 1 nm stepwise input (every 10 psi), and it was implemented to provide up to ∼10 nm fine motion along with the PZT coarse motion (1 µm). The hysteresis characteristics of the FPFM were also characterized and compensated to track the positioning error.

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Characterization of thermally stable compliant structures with internal fluidic channels

Cited by 5 publications

References 22 publications

A Novel Thermal Deformation Self-Stabilization Flexible Connection Mechanism

A Novel Thermal Deformation Self-Stabilization Flexible Connection Mechanism

On the applications of additive manufacturing in semiconductor manufacturing equipment

A monolithic linear motion platform driven by a piezoelectric and fluidic pressure-fed dual mechanism

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