2006
DOI: 10.1117/12.682585
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Characterization of thermal resistance coefficient of high-power LEDs

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Cited by 45 publications
(28 citation statements)
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“…Thermal resistance coefficient depends on the power dissipation at the junction, ambient temperature, amount of heat sink and the orientation of the heath sink [2,3]. For the purpose of real-time health monitoring and prognostics, we assume the average power dissipation of the LED remains constant and ambient temperature, amount of heat sink and orientation of the heat sink remain same.…”
Section: Led Health Monitoringmentioning
confidence: 99%
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“…Thermal resistance coefficient depends on the power dissipation at the junction, ambient temperature, amount of heat sink and the orientation of the heath sink [2,3]. For the purpose of real-time health monitoring and prognostics, we assume the average power dissipation of the LED remains constant and ambient temperature, amount of heat sink and orientation of the heat sink remain same.…”
Section: Led Health Monitoringmentioning
confidence: 99%
“…It is impossible to measure the p-n junction temperature directly as it is impossible to reach the p-n junction. However, it is possible to estimate this value by measuring the temperature at a nearest point to the p-n junction, and then use the following one-dimensional heat conduction equation to estimate the junction temperature [2,3].…”
Section: Led Health Monitoringmentioning
confidence: 99%
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“…However, the studies on thermal resistance of low power devices (e.g. LED [9], transistors [10]) may not be applicable to high power IGBTs due to the dramatic difference in material and geometry. IGBT thermal resistance dependence on power loss is studied and proved by experiments in [11], whereas it is difficult to apply the results in circuit simulations due to a lack of quantitative conclusion.…”
Section: Introductionmentioning
confidence: 99%
“…The correlation of thermal resistance and ambient temperature has been studied in [9]- [12] for the semiconductor devices. However, the studies on thermal resistance of low power devices (e.g.…”
Section: Introductionmentioning
confidence: 99%