Characterization of the mechanical properties and structural integrity of T-welded connections repaired by grinding and wet welding

Fracture Toughness and Charpy CVN Data for A36 Steel with Wet Welding

“…The T-welded connections were welded employing E6013 electrodes following the procedure detailed by Terán et al [17,18] and conforming to the welding procedure specification (WPS) AWS D.1.1/D1.1M code [19]. In Figure 1a, T-welded connections and Charpy specimens are graphically presented.…”

“…Two different grinding depths of 6 mm and 10 mm, corresponding to 30% and 50% of the plate thickness, respectively, were carried out at the weld toe of the T-welded connections. Then, underwater wet welding was employed with three different water depths of 50 m, 70 m and 100 m. The wet welding method was done according to [18,20]. A hyperbaric chamber was employed to simulate the water depths, see Figure 1b.…”

“…The overview of absorbed energy versus water depth is displayed in Figure 2. One objective in observing the absorbed [27] 50 20 483 Di Lorenzo et al [30] 19 39 --38 33 --58 25 --Pessoa [28] 50 13 450 100 12 425 Santo [29] 0.5 45.6 511 Teran et al [17,18] 50 energy and temperature data is to know the ductile-brittle behavior from the Charpy transition temperature curve of the wet welding.…”

“…The toughness and ductility are more affected than yield and strength limits [40]. The following microstructure phases were identified [17,18]: ferrite with aligned second phase (FSA), sideplate ferrite (FS) and grain-boundary ferrite (GBF). These microstructures are typical of low mechanical properties according to Charpy impact test values.…”

“…West et al [22] 2 112 10 110 Szelagoswki et al [23] 55 87 61 59 Szelagoswki [24] 6 100 55 75 101 53 Grubbs and Reynolds [25] 6 118 10 102 50 103 99 96 Rowe et al [26] 21 71 43 63 61 56 91 49 Perez-Guerrero et al [27] 50 69 Pessoa [28] 50 50 100 46 Santos [29] 0.5 116 Teran et al [17,18] 50 It can be seen, as expected, that K IC values reported by Barsom [13] are close to the real K IC measured values. It is necessary, however, to compare this data testing with the ASTM E399 [9].…”