Characterization of the Low-Curing-Temperature Silver Paste with Silver 2-Ethylhexanoate Addition

Abstract

In this study, the effects of the solvent and atmosphere on the thermal decomposition behaviors of silver 2-ethylhexanoate and -terpenol are investigated. Low-curing-temperature silver pastes made from Ag flakes, -terpineol and various amounts of silver 2-ethylhexanoate, were prepared and characterized. The microstructures and resistivities of cured films screen-printed from the pastes were examined. The results of thermal analysis in oxidizing and reducing atmospheres revealed that thermal decomposition is the dominating reaction during the heating process of silver 2-ethylhexanoate, even though the differential scanning calorimetry (DSC) result revealed an exothermic reaction for silver 2-ethylhexanoate heated in air due to oxidation. Thermal decomposition left almost pure Ag particles, which is beneficial for bridging between silver flake particles in the films. On the basis of the rheological behavior, microstructural evolution and electrical evaluation, it can be concluded that a low-curing-temperature silver paste with 5 wt % silver 2-ethylhexanoate addition is the best formulation, which possesses shear-thinning and thixotropic properties and a resistivity of 7:8 Â 10 À6 cm after being cured at 250 C, which is relatively close to the bulk resistivity of Ag.

Printed electronics: the challenges involved in printing devices, interconnects, and contacts based on inorganic materials

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Argon plasma sintering of inkjet printed silver tracks on polymer substrates

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Molecular Approach To Enhance Thermal Conductivity in Electrically Conductive Adhesives

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