Characterization of the layer growth of plasma-polymerized HMDSO coatings on polycarbonate

Michaeli, Walter; Fonteiner, Ingrid; Goebel, Sebastian

doi:10.1002/1439-2054(20001201)284:1<30::aid-mame30>3.0.co;2-5

Cited by 1 publication

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“…[20][21][22][23][24][25][26][27][28][29] Therefore, we examine the deposition rates of HMDSO plasmas as a standard process to compare different plasma reactor setups and to get insights for controlling the degree of retention of molecular structure, functional groups, and elemental composition to design functional coatings. For example, the control of the residual hydrocarbon content in SiOC:H films deposited from HMDSO enables the adjustment of film properties, such as hardness, 30,31 internal stresses, 20,32 abrasion resistance, 33,34 elasticity, 30,31 wettability, 20,31,32,35 biocompatibility, 35,36 as well as protective, 23,37 optical, 20,23 barrier, [38][39][40] diffusion, 41 and sorption properties. 42…”

Section: Standard Processmentioning

confidence: 99%

Design of functional coatings

Hegemann

Oehr

Fischer

2004

Journal of Vacuum Science &Amp; Technology A: Vacuum, Surfaces, and Films

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Based on the principle of macroscopic kinetics, we present the concept of a standard process to compare different rf plasma reactors. Therefore, the mass deposition rate of pure hexamethyldisiloxane (HMDSO) discharges was chosen, since the plasma polymerization of HMDSO is a radical-dominated process and ion-induced effects can be neglected for a wide parameter range. Two experimental series with pure HMDSO discharges were performed within a symmetrical and a strongly asymmetrical rf plasma reactor. The obtained deposition rates were compared to four experimental series taken out of the literature concerning the deposition rates of plasma polymerized HMDSO coatings. While for each reactor design, the "specific energy" W/F was found to describe the deposition rates very well, different apparent activation energies E-a were obtained. To bring the data sets into agreement, a new process constant E-a d(act) is introduced taking the width of the active plasma zone d(act) into account. By this means, functionally gradient SiOC:H films can be designed, e.g., for adhesion, wetting, or barrier improvements. Moreover, processes can be optimized and scaled up. (C) 2005 American Vacuum Society

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