Characterization of the interface between ceramics reinforcement and lead-free solder matrix

Pal, Manoj Kumar; Gergely, Gréta; Koncz-Horváth, Dániel; Gácsi, Zoltán

doi:10.1016/j.surfin.2020.100576

Cited by 21 publications

(7 citation statements)

References 24 publications

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“…SiC particles were coated independently with nickel via an electroless technique. [20][21][22] Table 1 shows the process of Ni-coating on silicon carbide particles.…”

Section: Methodsmentioning

confidence: 99%

Distribution and Microstructure Analysis of Ceramic Particles in the Lead‐Free Solder Matrix

Pal

Gergely

Koncz-Horváth

et al. 2020

Crystal Research and Technology

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The Sn-3.5Ag-0.5Cu (SAC305) solder alloy is a prominent candidate for the Pb-free solder, and SAC305 solder is generally employed in today's electronic enterprise. In this study, the formation of intermetallic compounds (Cu 6 Sn 5 and Ag 3 Sn) in the solder (bulk area), average neighboring particle distance, and the morphological mosaic are examined by the addition of silicon carbide (SiC) and nickel-coated SiC reinforcements within Sn-3.5Ag-0.5Cu solder. Results reveal that the addition of SiC and SiC(Ni) particles is associated with a small change to the average neighboring particle distance and a decrease in clustering rate to a certain limit of the Sn-3.5Ag-0.5Cu solder composites. Moreover, the development of the Cu 6 Sn 5 and the structure of the Ag 3 Sn are improved with the addition of SiC and Ni-coated SiC.

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“…SiC particles were coated independently with nickel via an electroless technique. [20][21][22] Table 1 shows the process of Ni-coating on silicon carbide particles.…”

Section: Methodsmentioning

confidence: 99%

Distribution and Microstructure Analysis of Ceramic Particles in the Lead‐Free Solder Matrix

Pal

Gergely

Koncz-Horváth

et al. 2020

Crystal Research and Technology

Self Cite

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“…With the continuous advancement of semiconductor manufacturing technology, the chips are developing in the direction of miniaturization, densification, and high power. − The quality of the package directly affects the performance of the chip. SnPb solder is widely used in electronic packaging due to its low price, good wettability, and low melting point. , However, the European Union passed the Waste Electrical and Electronic Equipment (WEEE) and Restriction of Hazardous Substance (ROHS) directives to ban the use of Pb in electronic products due to its toxicity. , Therefore, the research on lead-free solder has become a hot topic. At present, the main lead-free solders include SnCu, SnAgCu, SnAg, SnBi, and SnZn. − SnCu solder is considered a good substitute for SnPb solder for its low cost, low resistivity, and excellent mechanical properties .…”

Section: Introductionmentioning

confidence: 99%

Effects of Co Nanoparticles Embedded in Carbon Skeleton Nanosheet Addition to Sn-0.7Cu Solder on the Interfacial Reaction

Gao

Lin

et al. 2023

ACS Appl. Nano Mater.

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The application of Sn-0.7Cu solder in electronic packaging is limited by its high melting point, low wettability, and poor solderability. Herein, we obtain Co nanoparticles embedded in carbon skeleton nanosheets (Co&C) via a metal-organicframework (MOF)-derived method. The composite solder is successfully prepared by adding Co&C into Sn-0.7Cu. The results show that the addition of minor amounts of Co&C has little influence on the melting point of the composite solder. In addition, the wettability of the composite solder is effectively enhanced by the adsorption effect of Co&C. The minimum wetting angle of the composite solder is 27.9°when the content of Co&C is 0.08 wt %. With the addition of Co&C, the microstructure of the solder is refined, and the best refinement effect is achieved when the content of Co&C is 0.08 wt %. Furthermore, adding Co&C can reduce the thickness of the intermetallic compounds (IMCs) and transform the scalloped IMCs into a planar shape. Reflowed for 2100 s, the IMCs at the Sn-0.7Cu-0.08Co&C/Cu interface maintain a planar shape, and their thickness is reduced by 21.10% compared with that of the Sn-0.7Cu/Cu interface. The synergistic effect between Co and carbon in Co&C jointly controls the interface reaction and the growth of IMCs.

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“…To solve this problem, metallic coatings can be applied to the surface of carbon materials to improve adaptation to the solder matrices before implementation. For example, Ni atoms were deposited on the surface of ceramic reinforcing additions, thus forming core–shell structures (Kumar et al 2020 , 2021 ). The metal-coated layer formed in this way formed a strong “bridge” that reacted with the lead-free solder matrix to form an intermetallic layer in course of soldering (Han et al 2012 ; Chen et al 2022 ).…”

Section: Introductionmentioning

confidence: 99%

Metal deposited nanoparticles as “bridge materials” for lead-free solder nanocomposites

et al. 2023

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An influence of carbon nanotubes and carbon nanospheres coated by Au–Pd and Pt on the microstructure of solder/copper joints at room temperature and after aging at sub-zero temperature. The carbon nanosized admixtures were mixed with ternary Sn3.0Ag0.5Cu matrix to prepare a composite solder. The microstructure of the solder joints between the nanocomposite solders and a copper substrate was studied by scanning electron microscopy. It was found that minor (0.05 wt. %) admixtures of both the carbon nanospheres and nanotubes increase the shear strength of the solder joints and reduce the growth rate of the intermetallic Cu6Sn5 layer, formed at the interface between solder and copper. This effect may be related to the adsorption of nanoinclusions on the grain surface during the solidification process. Comparative analysis suggests that exposure for 2 months at 253 K does not lead to deterioration of such an important mechanical characteristic of the solder joint as shear strength, indicating the possibility of using these nanocomposite solders in microelectronic equipment even at temperatures below 0 ℃.

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Characterization of the interface between ceramics reinforcement and lead-free solder matrix

Cited by 21 publications

References 24 publications

Distribution and Microstructure Analysis of Ceramic Particles in the Lead‐Free Solder Matrix

Distribution and Microstructure Analysis of Ceramic Particles in the Lead‐Free Solder Matrix

Effects of Co Nanoparticles Embedded in Carbon Skeleton Nanosheet Addition to Sn-0.7Cu Solder on the Interfacial Reaction

Metal deposited nanoparticles as “bridge materials” for lead-free solder nanocomposites

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