Characterization of the dynamics of encapsulated silicon MEMS devices using low-coherence heterodyne LDV technology

Wolfer, Marco; Giesen, Moritz; Heilig, Markus; Seyfried, V.; Winter, Marcus

doi:10.1016/j.mne.2023.100191

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2024

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Cited by 2 publications

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“…Then, 50:50 BS1 splits the reference beam into beam1 and beam2 on average. (6) Beam1 and echo3 are combined by 50:50 BS2 from different directions. Then, two beams propagate to PBS3 together and produce two interference signals I1 and I2 which are received by PD1 (photodetector) and PD2 respectively.…”

Section: Measurement Principlesmentioning

confidence: 99%

“…It is an alternative to the conventional contacting vibration sensors. With the advantages of wide frequency response and high spatial resolution [1], LDV has been widely used in acoustics [2], automobile manufacturing [3], aerospace [4], quality inspection [5], and MEMS systems [6]. However, speckle noise caused by the laser speckle effect is the dominant factor limiting the development of LDV.…”

Section: Introductionmentioning

confidence: 99%

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