2015
DOI: 10.1016/j.jmatprotec.2014.08.022
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Characterization of the deformation field in large-strain extrusion machining

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Cited by 40 publications
(13 citation statements)
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“…Indeed, optical microscopy can easily be coupled with high speed imaging and thus offer a way to work around the two difficulties mentioned in the above. The use of Digital Image Correlation (DIC) has enabled the computation of strains and strain rates at microscale and low cutting speed (V c = 6.10 −4 m.min −1 ) along continuous chips in [13] and at higher speed (V c = 6 m.min −1 ) in serrated chips in [15,44]. Nevertheless, this technique requires unblurred images and is thus often used at low-to-moderate cutting speed.…”
Section: Introductionmentioning
confidence: 99%
“…Indeed, optical microscopy can easily be coupled with high speed imaging and thus offer a way to work around the two difficulties mentioned in the above. The use of Digital Image Correlation (DIC) has enabled the computation of strains and strain rates at microscale and low cutting speed (V c = 6.10 −4 m.min −1 ) along continuous chips in [13] and at higher speed (V c = 6 m.min −1 ) in serrated chips in [15,44]. Nevertheless, this technique requires unblurred images and is thus often used at low-to-moderate cutting speed.…”
Section: Introductionmentioning
confidence: 99%
“…The tool with a precut depth t 0 is cutting the workpiece at the cutting speed V 0 , and the chip thickness t c is controlled by the constraint in HSEM. As for free machining (FM), where the constraint is useless, the chip thickness t * c is a materialdependent parameter [28]. The wedge-shaped tool with a rake angle α is machining the cutting layer.…”
Section: Methodsmentioning
confidence: 99%
“…Chandrasekar and co-workers further devised a large-strain extrusion machining (LSEM) apparatus to fabricate ultrafine grain materials (UFGs) at a low cutting speed [27]. Recently, inspired by the works of Chiffre and Chandrasekar, Dai et al developed a high-speed extrusion machining (HSEM) device to research the effect of constraint on the chip formation during HSM [28]. They stated that the chip morphology transforms from serrated to continuous chips once the constraint extrusion factor is equal to or greater than a certain value [29].…”
Section: Introductionmentioning
confidence: 99%
“…In order to control the deformation field, Chandrasekar further devised a large strain extrusion machining (LSEM) apparatus by introducing constraint into machining [25]. Dai and co-workers developed the dynamic LSEM and quasi-static LSEM devices to research the suppression of repeated adiabatic shear banding and deformation field [26,27].…”
Section: Introductionmentioning
confidence: 99%