Characterization of the curing process of mixed pine and spruce tannin-based foams by different methods

Čop, Matjaž; Gospodarič, Bojan; Kemppainen, Katariina; Giovando, Samuele; Laborie, Marie‐Pierre; Pizzi, A.; Šernek, Milan

doi:10.1016/j.eurpolymj.2015.05.020

Cited by 14 publications

(6 citation statements)

References 31 publications

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“…Some authors have described the relationships between various methods, but the results are not consistent, which might be attributed to different studied adhesives and different research approaches, although some common conclusions regarding cited literature can be made. In two studies, DMA (bending and oscillatory tests) and DEA results expressed similar results on urea-formaldehyde adhesive and tannin foams (Pretschuh et al 2012;Čop et al 2015). The DEA, in comparison with ABES, was found to determine the curing process faster than ABES on phenol-formaldehyde adhesive.…”

Section: Introductionmentioning

confidence: 70%

“…The DMA-rheology was conducted on tannin formaldehyde adhesives (Garnier et al 2002a(Garnier et al , 2002b; and the TMA and ABES methods were performed on tannin hexamine adhesives (Lecourt et al 2003). The DSC, TGA, and DMA curing characterizations were completed on tannin-based epoxy resin (Benyahya et al 2014), and the curing characterization of tannin foams was studied with DEA, DSC, and DMA (Basso et al 2013;Čop et al 2015) methods. Modification of urea-formaldehyde adhesive with birch bark was investigated with DSC, TGA and DTG (Reh et al 2021).…”

Section: Introductionmentioning

confidence: 99%

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Curing characterization of tannin-hexamine adhesive by automated bonding evaluation system, dielectric analysis, and dynamic mechanical analysis

Saražin

Šega

Šernek

2021

BioRes

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The characterization of the curing process allows the determination of the optimal pressing parameters, which is essential for the economical production of wood-based composites. In this study, an automated bonding evaluation system (ABES), dielectric analysis (DEA), and dynamic mechanical analysis (DMA) were used to determine the curing parameters of biobased pine tannin-hexamine adhesive at five temperatures ranging from 75 to 175 °C. This study aimed to compare the three above methods and to find correlations between them. All methods showed the same trend of the curing process, which became faster with increasing temperature. Due to various heating rates among the different methods, the curves representing the degree of cure were shifted to the left for the period in which nearly isothermal conditions were reached. It was determined that these methods could be mutually comparable. The ABES was regarded as the reference method; the DEA was regarded as a method that overestimates the curing process and that describes the beginning of the curing process more precisely; and the DMA method was regarded as a method that underestimates the curing process and that describes the end of the curing process more precisely. Linear trend lines were found between the observed methods.

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Section: Introductionmentioning

confidence: 70%

Section: Introductionmentioning

confidence: 99%

Curing characterization of tannin-hexamine adhesive by automated bonding evaluation system, dielectric analysis, and dynamic mechanical analysis

Saražin

Šega

Šernek

2021

BioRes

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“…where ΔH(t) represents the amount of enthalpy dissipated from the reaction in time t, and ΔHT is stated as the total enthalpy of the reaction [18].…”

Section: Thermal Analysis Of the Adhesive With Dscmentioning

confidence: 99%

Curing Kinetics of Tannin and Lignin Biobased Adhesives Determined by DSC and ABES

Saražin¹,

Poljanšek²,

Pizzi³

et al. 2022

Journal of Renewable Materials

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The curing process of two biobased adhesives: pine tanninhexamine (TH) and organosolv lignin non-isocyanate polyurethane (NIPU), suitable for interior nonstructural use, were compared with commercial urea-formaldehyde (UF) adhesive. Changes in chemical structure before and after the curing process were observed with Fouriertransform infrared spectroscopy (FTIR). The process of adhesive curing was monitored with differential scanning calorimetry (DSC) and the automated bonding evaluation system (ABES). Both DSC and ABES measurements confirmed UF as the fastest and NIPU as the slowest curing adhesive observed. Taking into account the ABES results, the optimal pressing parameters for the TH adhesive would be 4 min at 175°C, for the NIPU adhesive 7 min at 200°C and for the UF 1.5 min at 100°C. Strong linear correlation was observed between mechanical and chemical curing for the UF and NIPU adhesives, whereas lower correlation was observed for the TH adhesive. At all observed adhesives, the DSC measurements were underestimating the curing process determined by ABES in the first part and overestimating it at the end. The underestimation was the most evident with the TH adhesive and the less with the UF adhesive. When comparing the uncured and cured FTIR spectra of all three types of adhesives, a drastic decrease in the characteristic band of -OH groups at 3330-3400 cm −1 and an increase in the signal intensity at 2920 cm −1 of aliphatic -CH 2 -groups were observed. For the UF adhesive, the C=O stretching frequency has shifted from 1632 cm −1 for uncured to three different bands at 1766, 1701, and 1655 cm −1 for cured UF. The sharp band for phenolic alcohols at 1236 cm −1 of C-O stretch and hydroxyl O-H functional group at 1009 cm −1 and at 684 cm −1 of uncured TH adhesive diminished during curing, which indicates that a crosslinking reaction occurs via -OH groups. The peak of the C=O group of urethane bridges at 1697 cm −1 for uncured NIPU shifted to lower wavenumber at 1633 cm −1 for cured NIPU.

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“…Several such studies were carried out on commercial synthetic adhesives, but only a few were performed on biobased ones. The curing process characterization of biobased adhesive materials was studied with liquefied wood (Ugovšek and Šernek 2013), tannin adhesives (Pizzi and van der Spuy 1980;Garnier et al 2002a,b), tannin foams (Basso et al 2013;Čop et al 2015), tannin based epoxy resin (Benyahya et al 2014), and lignin-based epoxy resin (Ferdosian et al 2015).…”

Section: Introductionmentioning

confidence: 99%

Bio-based adhesive mixtures of pine tannin and different types of lignins

Saražin

Schmiedl

Pizzi

et al. 2020

BioRes

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Tannins and lignins, which are natural phenolic compounds, are gaining substantial interest in biobased wood adhesive research. In this study, several different biobased tannin-lignin-hexamine adhesive mixtures were prepared and compared in a lap-joint shear strength test. In the first part, the suitability of different types of kraft and organosolv lignins as part of the mixture used in the production of biobased adhesives (in combination with pine tannins) were observed. It was found that biobased adhesive mixtures containing kraft lignins performed significantly better than those that contained organosolv lignins. In the second part, unmodified kraft lignins were mixed with pine tannin in different proportions, ranging from 0% to 100%. The pressing parameters were set to 150 °C for 15 min after performing oscillatory tests with a rheometer. Pure tannin adhesives performed the best, but no significant differences or a trend line were observed among adhesives containing different proportions of tannins and lignins.

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Characterization of the curing process of mixed pine and spruce tannin-based foams by different methods

Cited by 14 publications

References 31 publications

Curing characterization of tannin-hexamine adhesive by automated bonding evaluation system, dielectric analysis, and dynamic mechanical analysis

Curing characterization of tannin-hexamine adhesive by automated bonding evaluation system, dielectric analysis, and dynamic mechanical analysis

Curing Kinetics of Tannin and Lignin Biobased Adhesives Determined by DSC and ABES

Bio-based adhesive mixtures of pine tannin and different types of lignins

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