Characterization of strength properties of thin polycrystalline silicon films for MEMS applications

Boroch, Robert Edward; Wiaranowski, J.; Mueller-Fiedler, Roland; Ebert, Matthias; Bagdahn, J.

doi:10.1111/j.1460-2695.2006.01055.x

Cited by 26 publications

(17 citation statements)

References 12 publications

(16 reference statements)

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“…The increased r f and increased variability at notch features has been demonstrated and analyzed in several prior studies, e.g., Refs. 84,131,and 236. Chasiotis and Knauss evaluated the effect of twodimensional circular and elliptical perforations in the center of a polysilicon tensile bar with radii of curvature ranging from 1 to 8 lm and nominal stress concentration factors of 3-8. 134 They showed that after accounting for the SIF, samples with a 1 lm radius perforation were still 50% stronger than samples with an 8 lm radius.…”

Section: Geometrymentioning

confidence: 99%

Fracture strength of micro- and nano-scale silicon components

DelRio

Cook

Boyce

2015

Applied Physics Reviews

103

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Silicon devices are ubiquitous in many micro- and nano-scale technological applications, most notably microelectronics and microelectromechanical systems (MEMS). Despite their widespread usage, however, issues related to uncertain mechanical reliability remain a major factor inhibiting the further advancement of device commercialization. In particular, reliability issues related to the fracture of MEMS components have become increasingly important given continued reductions in critical feature sizes coupled with recent escalations in both MEMS device actuation forces and harsh usage conditions. In this review, the fracture strength of micro- and nano-scale silicon components in the context of MEMS is considered. An overview of the crystal structure and elastic and fracture properties of both single-crystal silicon (SCS) and polycrystalline silicon (polysilicon) is presented. Experimental methods for the deposition of SCS and polysilicon films, fabrication of fracture-strength test components, and analysis of strength data are also summarized. SCS and polysilicon fracture strength results as a function of processing conditions, component size and geometry, and test temperature, environment, and loading rate are then surveyed and analyzed to form overarching processing-structure-property-performance relationships. Future studies are suggested to advance our current view of these relationships and their impacts on the manufacturing yield, device performance, and operational reliability of micro- and nano-scale silicon devices.

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Section: Geometrymentioning

confidence: 99%

Fracture strength of micro- and nano-scale silicon components

DelRio

Cook

Boyce

2015

Applied Physics Reviews

103

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“…18 ranks the resulting scatter in life data on a two-parameter Weibull probability plot. Weibull approaches are commonly used [30] to estimate the probability of survival of a mechanical system. The slope of the two-parameter Weibull fit provides a measure of scatter in the data.…”

Section: Effect Of Microstructure Topologymentioning

confidence: 99%

Experimental and numerical investigation of fatigue of thin tensile specimen

Bomidi

Weinzapfel

Wang

et al. 2012

International Journal of Fatigue

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“…Here we a-priori assume that in case of impacts a major role is played by the propagation of cracks at grain boundaries and within grains [4]. Since polysilicon is brittle at room temperature [5], a local rupture can occur when the stress field satisfies a stress-based failure criterion. We therefore avoid running micro-scale simulations; instead, an experimentally determined tensile strength of the polysilicon is required.…”

Section: Introductionmentioning

confidence: 99%

Multi-scale Analysis of MEMS Sensors Subject to Drop Impacts

Mariani

Ghisi

Corigliano

et al. 2007

Sensors

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The effect of accidental drops on MEMS sensors are examined within the framework of a multi-scale finite element approach. With specific reference to a polysilicon MEMS accelerometer supported by a naked die, the analysis is decoupled into macro-scale (at die length-scale) and meso-scale (at MEMS length-scale) simulations, accounting for the very small inertial contribution of the sensor to the overall dynamics of the device. Macro-scale analyses are adopted to get insights into the link between shock waves caused by the impact against a target surface and propagating inside the die, and the displacement/acceleration histories at the MEMS anchor points. Meso-scale analyses are adopted to detect the most stressed details of the sensor and to assess whether the impact can lead to possible localized failures. Numerical results show that the acceleration at sensor anchors cannot be considered an objective indicator for drop severity. Instead, accurate analyses at sensor level are necessary to establish how MEMS can fail because of drops.

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Characterization of strength properties of thin polycrystalline silicon films for MEMS applications

Cited by 26 publications

References 12 publications

Fracture strength of micro- and nano-scale silicon components

Fracture strength of micro- and nano-scale silicon components

Experimental and numerical investigation of fatigue of thin tensile specimen

Multi-scale Analysis of MEMS Sensors Subject to Drop Impacts

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