2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and 2019
DOI: 10.1109/eurosime.2019.8724592
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Characterization of Stochastically Distributed Voids in Sintered Nano-Silver Joints

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“…Considering its outstanding ability to withstand heat, power, and stable mechanical properties [3][4][5], the sintered silver material has broad potential applications in harsh environments. However, compared to nano-silver particles [6][7][8], the pressureless sintered micron silver is affordable but is given less attention.…”
Section: Introductionmentioning
confidence: 99%
“…Considering its outstanding ability to withstand heat, power, and stable mechanical properties [3][4][5], the sintered silver material has broad potential applications in harsh environments. However, compared to nano-silver particles [6][7][8], the pressureless sintered micron silver is affordable but is given less attention.…”
Section: Introductionmentioning
confidence: 99%