Characterization of soldering alloy type Zn-In-Mg and the study of direct soldering of silicon and copper

Unveiling the reaction products in heat treated Si3N4-Ti joined ceramics by transmission electron microscopy

“…Another but less likely possibility is Ti 2 N phase that may be generated by Ti 3 N 2 phase dissociation (Eqs. (15) and (16)) or reaction between the Ti 3 N 2 and Ti in the Ti metal foil side of the joint (Eq. (17)).…”

“…Therefore, below reactions for the development of related phases can be proposed: 6Ti + Si 3 N 4 → 2Ti 3 N 2 + 3Si (13) Ti 3 N → Ti 2 N + Ti (14) 3Ti 3 N 2 + 3Si → Ti 5 Si 3 + 2Ti 2 N + 2N 2(g) (15) Ti 3 N 2 → Ti 2 N + Ti + 1/2N 2(g) (16) 3Ti 3 N 2 + Ti → 5Ti 2 N + 1/2N 2(g) (17) 3Ti 2 N + 3Si → Ti 6 Si 3 N + 1/2N 2(g) (18) It is important to state that Ti 6 Si 3 N, Ti 3 N 2 , and Ti 2 N phases have not been so far visualized by using advanced and analytical TEM techniques at heat-treated Si 3 N 4 -Ti interfaces, until current research are performed. Although their formations were known in Refs.…”

“…For instance, Ag-Cu eutectic alloys containing Ti have been used very widely so far since strong wetting, spreading, and bonding effects of active Ti metal on the ceramic surfaces can be achieved [11,12]. On the other hand, a number of studies have examined and calculated Si 3 N 4 -Ti, Ti-Si, Ti-N, and Ti-Si-N systems using different techniques such as diffusion bonding [13,14], ultrasonic brazing [15][16][17], in situ synthesis method [18], diffusion couples [19,20], and thermodynamic programs [21][22][23]. Especially, ultrasonic brazing technique has attracted significant attention recently, since it enables the bonding of dissimilar materials at low cost and in fast bonding time [15][16][17].…”

Joining of SiO2 glass and 316L stainless steel using Bi–Ag-based active solders

“…Wetting may be achieved by metallization of the substrate surfaces prior to the joining process [11], but an alternative, frequently used approach is adding chemically active elements, most commonly Ti, Zr and Hf to the solder alloy [12][13][14][15]. Furthermore, the use of Mg [16][17][18], V [19,20], Ta [21,22], Cr [23], Nb [24] and rare earth elements such as La [25,26] and Lu [27] is also reported in the literature. Wetting with the aid of active elements is associated with their enrichment at the substrate/solder interface, reaction with the substrate and consequently the formation of a reaction phase layer [28][29][30][31].…”