Characterization of solder joints made with VPS on DBC substrate

Skwarek, Agata; Illés, Béla; Synkiewicz, Beata; Wroński, Sebastian; Tarasiuk, Jacek; Witek, Krzysztof

doi:10.1007/s10854-016-5724-6

Cited by 5 publications

(6 citation statements)

References 14 publications

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“…9). (Skwarek et al, 2017). Dziurdzia et al, 2018 did statistically comparison about the void content in solder joints of LED and BGA components prepared by vacuum VPS and convection reflow soldering.…”

Section: Quality and Reliability Studies Of The Solder Joints Preparementioning

confidence: 99%

“…The void content of the solder joints effects on the mechanical, thermal and electrical parameters of the solder joints. Skwarek et al compared the mechanical stability of SAC solder joints on DBC substrates created by convection reflow soldering, simple VPS and vacuum VPS technologies (Skwarek et al, 2017). They found 15 per cent higher shear strength of the solder joints in the case of vacuum VPS and then at the solder joints prepared by convection reflow soldering.…”

Section: 4mentioning

confidence: 99%

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Vapour phase soldering (VPS) technology: a review

Illés

Géczy

Medgyes

et al. 2019

SSMT

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Purpose: This paper presents a review of the recent developments about the vapour phase soldering technology. This study focuses on the fallowing topics: recent developments of the technology (like soft and vacuum vapour phase soldering); measurement and characterization methods of vapour space (temperature and pressure); numerical simulation of the VPS soldering process (like condensate layer and solder joint formation); and quality and reliability studies of the solder joints prepared by VPS (like void content and microstructure of the solder joints). Design/methodology/approach: This study was written according to the results of a worldwide literature review about the substantial previous works in the past decade and according to the own results and experiences of authors from around the globe. Findings: Up to now, a part of the electronics industry believes that the reflow soldering with VPS method is a significant alternative of convection and infrared technologies. The summarized results of the field in this study supports this idea. Research limitations/implications: This literature review provides engineers and researchers with understanding the limitations and application possibilities of the VPS technology and the current challenges in soldering technology. Originality/value: Our paper summarizes the most important advantages of VPS technology compared to the other reflow soldering methods as well as points out the necessary further developments and possible research directions

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Section: Quality and Reliability Studies Of The Solder Joints Preparementioning

confidence: 99%

Section: 4mentioning

confidence: 99%

Vapour phase soldering (VPS) technology: a review

Illés

Géczy

Medgyes

et al. 2019

SSMT

Self Cite

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show abstract

“…A vacuum option seems to be necessary for this type of soldering. Without the application of underpressure in the last 5 s of soldering, the quality and the solder joint was much worse [12,20]. The results of the transient thermal impedance (Figure 6) showed differences in the course of the curves after 10s for the different soldering ovens, which reached 15% between the samples.…”

Section: Resultsmentioning

confidence: 99%

Section: Resultsmentioning

confidence: 99%

“…One of the most important quality factors that can influence thermal management in these components is gas void formation (empty spaces in the solder joints) [11]. Due to their high surface tension, lead-free solder alloys are more prone to void formation, since the outgassing of volatile organic compounds (e.g., fluxes) from the melted solder is limited [12]. The main influence of void presence could be the change in the thermal and electrical parameters of the components, since they can significantly affect the homogeneity of the connection.…”

Section: Introductionmentioning

confidence: 99%

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The Influence of Soldering Profile on the Thermal Parameters of Insulated Gate Bipolar Transistors (IGBTs)

et al. 2021

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The effect of solder joint fabrication on the thermal properties of IGBTs soldered onto glass-epoxy substrate (FR4) was investigated. Glass-epoxy substrates with a thickness of 1.50 mm, covered with a 35 μm thick Cu layer, were used. A surface finish was prepared from a hot air leveling (HAL) Sn99Cu0.7Ag0.3 layer with a thickness of 1 ÷ 40 μm. IGBT transistors NGB8207BN were soldered with SACX0307 (Sn99Ag0.3Cu0.7) paste. The samples were soldered in different soldering ovens and at different temperature profiles. The thermal impedance Zth(t) and thermal resistance Rthof the samples were measured. Microstructural and voids analyses were performed. It was found that the differences for different samples reached 15% and 20% for Zth(t) and Rth, respectively. Although the ratio of the gas voids in the solder joints varied between 3% and 30%, no correlation between the void ratios and Rth increase was found. In the case of the different soldering technologies, the microstructure of the solder joint showed significant differences in the thickness of the intermetallic compounds (IMC) layer; these differences correlated well with the time above liquidus during the soldering process. The thermal parameters of IGBTs could be changed due to the increased thermal conductivity of the IMC layer as compared to the thermal conductivity of the solder bulk. Our research highlighted the importance of the soldering technology used and the thermal profile in the case of the assembly of IGBT components.

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Influence of the soldering paste type on optical and thermal parameters of LED modules

Górecki

Ptak

Dziurdzia

2022

SSMT

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Purpose This paper presents the results of the investigations of LED modules soldered with the use of different soldering pastes. Design/methodology/approach The tested power LED modules are soldered using different solder pastes and soldering processes. Thermal parameters of the performed modules are tested using indirect electrical methods. The results of measurements obtained for different modules are compared and discussed. Findings It was shown that the soldering process visibly influences the results of measurements of optical and thermal parameters of LED modules. For example, values of thermal resistance of these modules and the efficiency of conversion of electrical energy into light differ between each other even by 15%. Practical implications The obtained results of investigations can be usable for designers of the assembly process of power LED modules. Originality/value This paper shows the investigations results in the area of effective assembly of power LEDs to the metal core printed circuit board (MCPCB) using different soldering pastes (REL22, REL61, LMPA-Q6, OM-5100, OM-338-PT, M8, OM-340, CVP-390). It was shown that the best thermal and optical properties of these modules are obtained for the OM5100 paste by Alpha Assembly.

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Characterization of solder joints made with VPS on DBC substrate

Cited by 5 publications

References 14 publications

Vapour phase soldering (VPS) technology: a review

Vapour phase soldering (VPS) technology: a review

The Influence of Soldering Profile on the Thermal Parameters of Insulated Gate Bipolar Transistors (IGBTs)

Influence of the soldering paste type on optical and thermal parameters of LED modules

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