Characterization of polysiloxane-block-polyimides with silicate group in the polysiloxane segments

Furukawa, Nobuyuki; Yuasa, Masatoshi; Kimura, Yoshiharu

doi:10.1016/s0032-3861(98)00256-0

Cited by 24 publications

(26 citation statements)

References 22 publications

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“…Block copolymerization offers several advantages over random copolymerization because the molecular architecture can be tailored to develop the materials with desirable structure and the functionality. It may offer a broader spectrum of properties to meet the demands of various applications 17–21. The desired properties achieved by block copolymerization cannot be obtained by random copolymerization, despite the fact that other parameters kept constant in both cases 22–24…”

Section: Introductionmentioning

confidence: 99%

Synthesis and characterization of benzimidazole‐based low CTE block copolyimides

urRehman

Song

et al. 2013

J of Applied Polymer Sci

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A series of block and random copolyimide films were synthesized from various molar ratios of two diamines, rigid 2-(4aminophenyl)-5-aminobenzimidazole (APBI) and flexible 4,4 0 -oxydianiline (ODA) by polycondensation with dianhydride 3,3 0 ,4,4 0biphenyltetracarboxylic dianhydride. The contents of APBI ranged from 10 to 60 mol % in copolyimides. The copolyimide films obtained by thermal imidization of poly(amic acid) solutions, were characterized by TMA, DMA, TGA, DSC, wide-angle X-ray diffraction, FTIR, tensile testing, water uptake (WU), and dielectric constant measurements. Rigid heterocyclic diamine APBI with interchain hydrogen bonding capability, led to low coefficient of thermal expansion (CTE), high T g , high thermal stability and better mechanical properties. Increasing the APBI mol % caused a gradual decrease in the CTE and increase in T g , thermal stability and tensile strength properties of the copolyimides films. Moreover, significantly enhanced thermal and mechanical properties of the block copolyimides were also found as compared to random copolyimides. The block copolyimide with APBI content of 60 mol %, achieved excellent properties, that is, a low CTE (4.7 ppm/K), a high T g at 377 C, 5% weight loss at 562 C and a tensile strength at 198 MPa. This can be interpreted because of comparatively higher degree of molecular orientation in block copolyimides. These copolyimides also exhibited better dielectric constant and WU. This combination of properties makes them attractive candidates for base film materials in future microelectronics.

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Section: Introductionmentioning

confidence: 99%

Synthesis and characterization of benzimidazole‐based low CTE block copolyimides

urRehman

Song

et al. 2013

J of Applied Polymer Sci

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“…14,15 In addition, the merit of organic silicone is their attractive integrated properties including thermal stability, 16,17 flame retardancy, 18 toughness, 19 and moisture resistance. 20 It is of great interest to introduce silicone into organic polymers [21][22][23][24][25] to endow the hybrids with excellent properties from both components. Many studies proved that silicon is an effective component in improving the antioxidation properties of polymers.…”

Section: Introductionmentioning

confidence: 99%

Preparation and thermal stability of heat-resistant phenolic resin system constructed by multiple heat-resistant compositions containing boron and silicon

Wang

Zhang

et al. 2016

High Performance Polymers

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This work reports a boron-and silicon-containing phenolic-formaldehyde (PF) resin exhibiting an extremely high thermal decomposition temperature and char yield and formed by copolymerizing phenol, formaldehyde, boric acid (BA), and phenyltriethoxysilane (PTES). The structure of BA and PTES-modified PF (BSPF) resin was characterized by Fourier transform infrared spectroscopy. Thermal stability of the investigated composites was estimated by means of thermogravimetric analysis (TGA). The results of TGA indicated that the modified resin exhibited excellent thermal stability. Specifically, the thermoset had a char yield of 77.0% when the boron and silicon contents were only 1.27 wt% and 1.7 wt%, respectively. Compared with the unmodified resin (PF), the temperature at the maximum decomposing rate of the BSPF increased by 84 C and its charring yield was enhanced by 15.0%. The cured products of PF and BSPF were further investigated by X-ray diffraction and Raman spectroscopy, respectively. The incorporation of boron and silicon into the carbon lattice results in a decrease of interlayer spacing, and Raman I D /I G values for PF and BSPF (2.63 and 1.32) show that the rearrangement of crystalline structure leads to an increase in graphite structure and a decrease in disordered structure upon the modification processes.

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“…An important example is the anti-graffiti (anti-adherent or easy cleaning) coating. For this specific type of coating, the best film morphology is one where the anti-adherent (AA) compound is located mainly on the external surface where it is required [7][8][9][10][11], while the bulk has to fulfill very different requirements such as: good adhesion to the substrate, appropriate mechanical properties, high abrasion resistance and in some cases, ease for pigmentation [12,13]. Therefore, the elaboration of good quality coatings does not only involve the use of the right constituents, but it is also required to place them in the appropriate position within the coating to perform each one their specific role, which in this particular case corresponds to place the AA on the external surface of the coating where is required.…”

Section: Introductionmentioning

confidence: 99%

Drying kinetics and segregation in a two-component anti-adherent coating studied by photoluminescence and Raman spectroscopies

Rodrı́guez

Jiménez‐Sandoval

Estévez³

et al. 2008

Journal of Non-Crystalline Solids

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Characterization of polysiloxane-block-polyimides with silicate group in the polysiloxane segments

Cited by 24 publications

References 22 publications

Synthesis and characterization of benzimidazole‐based low CTE block copolyimides

Synthesis and characterization of benzimidazole‐based low CTE block copolyimides

Preparation and thermal stability of heat-resistant phenolic resin system constructed by multiple heat-resistant compositions containing boron and silicon

Drying kinetics and segregation in a two-component anti-adherent coating studied by photoluminescence and Raman spectroscopies

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