Characterization of polymer matrix and low melting point solder for anisotropic conductive film

Eom, Yong‐Sung; Baek, Jin Wook; Moon, Jong-Tae; Nam, Jae-Do; Kim, Jong Min

doi:10.1016/j.mee.2007.07.005

Cited by 70 publications

(27 citation statements)

References 6 publications

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“…In previous research, 3) hybrid Cu paste (HCP) as an isotropic conductive paste (ICP) composed of metal powder and polymer resin was successfully developed. After curing process of conductive pattern with HCP, it is observed that metal particles are randomly exposed on the surface of conductive layer and other area is covered by cured resin.…”

Section: )mentioning

confidence: 99%

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Development of Copper Electro-Plating Technology on a Screen-Printed Conductive Pattern with Copper Paste

Eom¹,

Son²,

Lee³

et al. 2015

Journal of the Microelectronics and Packaging Society

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An electro-plating technology on a cured isotropic conductive pattern with a hybrid Cu paste composed of resin matrix, copper, and solder powders has been developed. In a conventional technology, Ag paste was used to perform a conductive pattern on a PCB or silicon substrate. From previous research, the electrical conductive mechanism and principle of the hybrid Cu paste were concisely investigated. The isotropic conductive pattern on the PCB substrate was performed using screen-printing technology. The optimum electro-plating condition was experimentally determined by processing parameters such as the metal content of the hybrid Cu paste, applied current density, and time for the electroplating in the plating bath. The surfaces and cross-sections were observed using optical and SEM photographs. In conclusion, the optimized processing conditions for Cu electro-plating technology on the conductive pattern were a current density of 40mA/cm 2 and a plating time of 20min on the hybrid Cu paste with a metal content of 44 vol.%. More details of the mechanical properties and processing conditions will be investigated in further research.

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Section: )mentioning

confidence: 99%

“…At the beginning the present research, the resin matrix based on epoxy to effectively remove oxide without the use of a conventional flux [3][4][5][6][7][8][9] was investigated. In addition, instead of the Ag paste used in, 9) HCP was finally developed and used to perform a conductive pattern.…”

Section: )mentioning

confidence: 99%

Development of Copper Electro-Plating Technology on a Screen-Printed Conductive Pattern with Copper Paste

Eom¹,

Son²,

Lee³

et al. 2015

Journal of the Microelectronics and Packaging Society

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“…In the curing stage, we heated the test vehicle at a ramped heating rate of 120 K/min up to 453 K until the resin was finally cured. Based on the previous work, 14) curing temperature and time were set at 453 K and 80 s in order ensure that polymer was sufficiently cured.…”

Section: Curing Behavior and Viscosity Characteristics Of Thementioning

confidence: 99%

“…Even though a new, improved class of ECA has been developed, low joint strength, silver migration, and difficulty in repairing these ECAs have also been reported. 8,9) To overcome these drawbacks, our group has suggested a low-melting-point alloy (LMPA)-filled anisotropically conducting adhesive (ACA) that employs hybrid bonding technology of soldering and an adhesive bonding process. Fluxing capability of the polymer matrix with regard to oxide films of both the LMPA fillers and the electrode materials during the interconnection process appears to provide a critical advantage to achieve a good electrical conduction path using this technology.…”

Section: Introductionmentioning

confidence: 99%

Self-Organized Interconnection Process Using Solderable ACA (Anisotropic Conductive Adhesive)

et al. 2009

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In this paper, we discuss our design of a new class of low-melting-point alloy (LMPA)-filled anisotropically conductive adhesives (ACA) and a self-organized interconnection process for using these adhesives, and we demonstrate a good electrical conduction for the process. Flow, melting, coalescence, and wetting characteristics of LMPA fillers in the ACA facilitate this process. In order to exploit good coalescence and wetting characteristics of LMPA fillers, the polymer matrix has a sufficient fluxing capability against oxide films of both LMPA fillers and electrode materials. Furthermore, it is essential that the polymer have a low viscosity level around the melting point of the incorporated LMPA to achieve a good electrical conduction path.In order to study coalescence and wetting characteristics, we formulated two types of ACA with different volume fractions of LMPA filler (10 vol% and 40 vol%). Our test board had an 18-mm thick Cu line-type pattern (10 mm Â 0:1 mm) and an area array-type pattern (square type: 0:1 mm Â 0:1 mm, circle type: ', 0.1 mm) with five different pitches (50 mm to 250 mm). We measured thermal properties of the ACA by differential scanning calorimetry (DSC), and we determined a temperature profile for the interconnection process. We then monitored coalescence and wetting characteristics of LMPA fillers and morphology of conduction path in ACA by using a microfocusing X-ray inspection system and an optical microscope.We determined that the developed LMPA-filled ACA have good coalescence and wetting characteristics regardless of pattern types. In addition, we were able to achieve a good electrical conduction path because of the coalescence and wetting characteristics of the LMPA fillers in the ACA.

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“…However, a conventional ICAs has several critical limitations such as lower conductivity, unstable contact resistance with non-noble metal finished components, Ag migration, and poor mechanical performance compared to traditional solder materials. [7][8][9] To improve the mechanical and electrical properties of ICA assembly, a new class of ICAs using carbon nanotubes (CNTs) and low melting point alloys (LMPAs) has been developed. As shown in Fig.…”

Section: Introductionmentioning

confidence: 99%

Characteristics of Isotropically Conductive Adhesive (ICA) Filled with Carbon Nanotubes (CNTs) and Low-Melting-Point Alloy Fillers

Yim

Kim

2010

Mater. Trans.

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A new class of isotropic conductive adhesive (ICA) using a carbon nanotubes (CNTs) and a low-melting-point alloy (LMPA) fillers has been developed. We investigated the fundamental materials characteristics including curing behavior and temperature-dependant viscous property of ICA. In addition, the morphology of conduction paths in each ICA was investigated using X-ray inspection systems and an optical microscope. Mechanical and electrical characteristics of formulated ICAs were determined and compared with those of three kinds of conventional ICAs filled with Ag flakes. The CNT-filled solderable ICA formed good metallurgical interconnection between upper and corresponding lower electrode. In addition, the results indicated that the CNT-filled ICA exhibit lower electrical resistance and higher mechanical strength, as compared with those of conventional ICAs.

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Characterization of polymer matrix and low melting point solder for anisotropic conductive film

Cited by 70 publications

References 6 publications

Development of Copper Electro-Plating Technology on a Screen-Printed Conductive Pattern with Copper Paste

Development of Copper Electro-Plating Technology on a Screen-Printed Conductive Pattern with Copper Paste

Self-Organized Interconnection Process Using Solderable ACA (Anisotropic Conductive Adhesive)

Characteristics of Isotropically Conductive Adhesive (ICA) Filled with Carbon Nanotubes (CNTs) and Low-Melting-Point Alloy Fillers

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