Characterization of nickel phosphorus surface by ToF-SIMS

Zhang, Bin C.; Barth, G; Liu, Hui Kathy; Chang, S.

doi:10.1016/j.apsusc.2004.03.153

Cited by 19 publications

(13 citation statements)

References 4 publications

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“…However, XPS spectra did not show the presence of NiP and NiS. Indeed, the literature has shown that NiP and NiS oxidize to nickel oxide, nickel hydroxide, nickel phosphate, nickel phosphite and nickel sulfate in the presence of oxygen 14a,b. The phosphorus and sulfur from these ionic liquids may therefore be unlikely to form NiP and NiS from a catalyst particle that has a layer of nickel oxide; this is common for finely divided nickel particles.…”

Section: Resultsmentioning

confidence: 91%

The Effects of SCILL Catalyst Modification on the Competitive Hydrogenation of 1‐Octyne and 1,7‐Octadiene versus 1‐Octene

2012

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Competitive hydrogenation of mixtures of related unsaturated compounds remains a challenging problem. Recently, solid catalysts with an ionic liquid layer (SCILL) have shown potential for increased catalyst selectivity under batch conditions. Our results for the continuous flow competitive hydrogenation of 1‐octyne and 1,7‐octadiene versus 1‐octene with a nickel SCILL catalyst indicate improved catalyst selectivity under trickle bed conditions. Different ionic liquids ([MMIM][MeOSO3], [MMIM][OcOSO3], [MMIM][NTf2], [MePsec‐Bu3 ][MeOSO3], and [Et3S][NTf2]; MMIM=1,3‐dimethylimidazole and Tf=trifluoromethanesulfonyl) with varying catalyst loadings were investigated. The results highlight the importance of potential site‐specific interactions by the ionic liquid. They also indicate the importance of the cation for these effects.

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Section: Resultsmentioning

confidence: 91%

The Effects of SCILL Catalyst Modification on the Competitive Hydrogenation of 1‐Octyne and 1,7‐Octadiene versus 1‐Octene

2012

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“…The HP coating revealed two chemical states of the phosphorus species, with elemental phosphorus (P0) and phosphite/ phosphate (P+). The elemental phosphorus 2p3/2 and 2p1/2 core levels are identified at 129.7 eV and 130.5 eV respectively . The phosphite/phosphate state of the phosphorus 2p core level for HP coating was present as a single broad peak that can be deconvoluted into two peaks at 133.1 eV (2p3/2) and 133.9 eV (2p1/2), as shown in figure a and b.…”

Section: Resultsmentioning

confidence: 89%

“…Early work suggested that the peak positions of the oxide/hydroxide state for the HP and MP coatings may be assigned to Ni 2 O 3 . However, more recent work proposed the presence of Ni(OH) 2 , which is more favourable since NiOH+ was also detected by ToF‐SIMS from freshly cleaned nickel metal exposed to ambient air for just 10 min .…”

Section: Resultsmentioning

confidence: 99%

Crystallisation and performance characteristics of high‐temperature annealed electroless Ni‐W‐P coatings

Liu

Yao

Liu

et al. 2014

Crystal Research and Technology

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Electroless deposition of Ni-P based alloys is a well-known commercial process that has numerous applications because of their excellent anticorrosive and wear properties. However, for some special occasions, like the components for gas making furnaces in chemical fertiliser industry, the coatings must be reinforced to withstand short-term high temperatures between 600°C and 700°C as well as light erosive wear. Therefore, co-deposition of high melting point metallic element, W, has been considered as a preferred choice. In the present study, two Ni-W-P alloy coatings were deposited on mild steel panels from different alkaline baths. The microstructures of the annealed coatings were characterised by quantitative XRD, XPS and SEM/EDS analysis techniques and their microhardness, friction and wear behaviour, corrosion mechanism as well as microstrain and residual stress are discussed in comparison with the as-plated state. The results indicate that the hardness mainly depends on the volume fraction and crystallite size of Ni 3 P phase; the uniform corrosion in sulfuric acid solution is closely related to the ratio of I Ni /I Ni3P as well as grain size. The wear mechanism of the high-temperature annealed coating is dominated by abrasive wear, but the wear in the early stages started from mild adhesive wear caused by adhesion between the friction couples. Electroless deposited Ni-W-P alloys with high phosphorus present relatively good properties, including hardness, wear and corrosion resistance when 700°C is applied for annealing process.

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“…The result indicates that the nickel in the surface region of the Ni‐P coating can exist in the form of Ni (852.3 eV), NiO (853.3 eV) and Ni(OH) 2 (855.8 eV) (Wagner et al , 1979). However, there may be other nickel species present such as nickel phosphate and phosphite that could contribute to the XPS spectrum (Zhang et al , 2004).…”

Section: Resultsmentioning

confidence: 99%

Solderability of electroless deposited Ni‐P coatings with Sn‐3.8Ag‐0.7Cu and Sn‐3.5Ag lead‐free solder alloys

Liu

Conway

2005

Circuit World

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PurposeTo study the influence of storage time and environment on the solderability of electroless nickel plated samples with Sn‐3.8Ag‐0.7Cu and Sn‐3.5Ag lead‐free solders and to provide criteria for the use of an electroless nickel (Ni‐P) under bump metallization (UBM) without immersion gold protection.Design/methodology/approachElectroless nickel coatings were deposited onto pure aluminium foil through a procedure developed for the UBM of wafers prior to flip chip bumping. Their solderability with lead‐free solders was studied using the wetting balance technique. Samples stored in different environments for different periods of time were tested to study the dependence of the solderability of Ni‐P coatings on the storage time and temperature. The degree of oxidation of the Ni‐P coatings was examined by means of X‐ray photoelectron spectroscopy and the surface microstructure and roughness of the coatings were analyzed by scanning electron microscopy and atomic force microscopy.FindingsIt was found that the Ni‐P coatings were unacceptable for direct soldering without the assistance of a flux, due to poor wettability, even when using a freshly prepared Ni‐P coating. Therefore, a suitable flux with nitrogen inerting had to be applied to assist the soldering process. The results also show that the solderability of Ni‐P coatings was affected by the phosphorus content, and the Ni‐P coating with high phosphorus content had a good solderability. The storage time and temperature did not influence the wettability significantly with the assistance of strong flux.Research limitations/implicationsThe stability of the plating solution and the consistence of the phosphorus content in the coating are not easily controlled. This has resulted in implications for surface analysis and wetting testing. Ni‐P coatings with different levels of phosphorus content are being investigated in detail.Originality/valueThe value of the paper lies in its study on the solderability of lead‐free solders to Ni‐P coating after storage in different environments and for different periods, which can provide some criteria for the use of Ni‐P UBM without immersion gold protection.

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Characterization of nickel phosphorus surface by ToF-SIMS

Cited by 19 publications

References 4 publications

The Effects of SCILL Catalyst Modification on the Competitive Hydrogenation of 1‐Octyne and 1,7‐Octadiene versus 1‐Octene

The Effects of SCILL Catalyst Modification on the Competitive Hydrogenation of 1‐Octyne and 1,7‐Octadiene versus 1‐Octene

Crystallisation and performance characteristics of high‐temperature annealed electroless Ni‐W‐P coatings

Solderability of electroless deposited Ni‐P coatings with Sn‐3.8Ag‐0.7Cu and Sn‐3.5Ag lead‐free solder alloys

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