Heat Transfer: Volume 2 2008
DOI: 10.1115/ht2008-56170
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Characterization of Microstructures for Heat Transfer Performance in Passive Cooling Devices

Abstract: The topology and geometry of microstructures play a crucial role in determining heat transfer performance in passive cooling devices such as heat pipes. It is therefore important to characterize microstructures based on their wicking performance, the thermal conduction resistance of the liquid filling the microstructure, and the thin-film characteristics of the liquid meniscus. In the present study, the free-surface shapes of the static liquid meniscus in common microstructures have been modeled using the prog… Show more

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Cited by 3 publications
(14 citation statements)
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“…This is also consistent with previous predictions by the authors based on a thermal resistance network model and static liquid meniscus shapes in the wick microstructure [1,2]. The thin-film area of the meniscus was reported to be highest for the case of packed spheres on a surface, based on staticequilibrium liquid meniscus shapes.…”
Section: Comparison Of Evaporative Performancesupporting
confidence: 81%
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“…This is also consistent with previous predictions by the authors based on a thermal resistance network model and static liquid meniscus shapes in the wick microstructure [1,2]. The thin-film area of the meniscus was reported to be highest for the case of packed spheres on a surface, based on staticequilibrium liquid meniscus shapes.…”
Section: Comparison Of Evaporative Performancesupporting
confidence: 81%
“…The solid-liquid contact angle has been demonstrated to have a significant effect on the thin-film area of a liquid meniscus [1,2]. Although copper-water is the solid-liquid combination considered in this work (with corresponding contact angles of 84° and 33° at the advancing and receding liquid fronts, respectively [24]), the contact angle is now varied to study its effect on evaporation.…”
Section: Influence Of Solid-liquid Contact Anglementioning
confidence: 99%
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