“…In this regard, transmission electron microscopy (TEM) studies combined with medium energy ion scattering analysis performed on atomic beam deposited La 2 O 3 films, have revealed that the composition of this material is far from uniform with significant penetration of silicon into the films from the substrate [5]. Similar results, pointing out the formation of interfacial lanthanum silicate (La x Si 1Àx O y ) layers, have been reported by Jun et al [4] using X-ray photoelectron spectroscopy and by Ohmi et al [6] using TEM images. Moreover, reliability studies have also demonstrated that the presence of weak spots in high-K dielectric films is common in such materials [7].…”