Characterization of Inkjet-Printed Silver Patterns for Application to Printed Circuit Board (PCB)

Shin, Kwang Yong; Lee, Minsu; Kang, Hyun-Su; Kang, Kyung‐Tae; Hwang, Jong Yeon; Kim, Jung-Mu; Lee, Sang-Ho

doi:10.5370/jeet.2013.8.3.603

Cited by 7 publications

(4 citation statements)

References 16 publications

(11 reference statements)

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“…In this work, it was also reported that narrow printed tracks may be more prone to faults under bending force. We used the 10 mm bending radius in bending tests, and our results are similar to those obtained with 16 mm bending radius presented in the work by Shin et al (2013). We did not observe a significant decrease in conductivity of the tested lines, and microscopic observation after tests did not reveal any damage in the samples tested.…”

Section: Resultssupporting

confidence: 85%

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Mechanical and thermal reliability of conductive circuits inkjet printed on flexible substrates

Araźna

Janeczek

Futera

2017

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Purpose This paper aims to present the results of investigations of inkjet-printed electronic circuits fabricated on a flexible substrate (KAPTON foil) using silver nanoparticles ink. Design/methodology/approach Fully inkjet-printed conductive circuit tracks were printed on a flexible, transparent KAPTON foil, using a commercial 40LT-15 C nanosilver ink as well as a PixDro LP50 inkjet printer with KonicaMinnolta 512 printhead. After cure, electrical properties by resistance measurements and printing quality by optical and SEM microscopic observation of conductive tracks were examined. Afterwards, the tested samples were annealed for 1, 2 and 3 h at 150°C or subjected to cycling bending. Findings It was found that silver nanoparticles ink could be used for the preparation of electronic circuits using the inkjet printing technique. The obtained patterns had appropriate mapping and good quality. It was also noticed that thermal annealing caused a decrease in resistivity values of the tested lines irrespective of their width. Approximately 34 per cent decrease was achieved in the values of resistivity of all the tested lines after the first hour of thermal annealing. After the second hour, the values of resistivity decreased by another 50 per cent. There were no visible changes in resistivity values after 1,000 cycles of bending. Originality/value In this paper, the results of thermal annealing and bending tests of inkjet-printed silver nanoparticle conductive tracks on flexible substrate were presented. That is very important information for producing printed circuit boards using ecological, rapid and low-cost inkjet printing techniques, particularly during the production of printed circuit boards on flexible substrates working in different conditions of mechanical and thermal stresses.

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Section: Resultssupporting

confidence: 85%

“…In the work by Shin et al (2013), the bending test of silver patterns on Polyethylene naphthalate (PEN) substrate was examined too. The effect of the bending radius and the line width was determined.…”

Section: Resultsmentioning

confidence: 99%

Mechanical and thermal reliability of conductive circuits inkjet printed on flexible substrates

Araźna

Janeczek

Futera

2017

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“…ECAs are extensively used in the assembly and packaging of electronic devices such as high-density multilayer interconnect substrates and high-speed, high-frequency circuits [ 1 , 6 , 7 , 8 , 9 , 10 ]. Among all of the ECAs, silver epoxy adhesives are most commonly used because of their high conductivity and stable contact resistance [ 11 , 12 , 13 , 14 ].…”

Section: Introductionmentioning

confidence: 99%

Improvement in the Thermal Conductivity of Silver Epoxy Adhesive by Treating with Water Vapor

et al. 2023

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With the miniaturization of electronic devices, electronic packaging has become increasingly precise and complex, which presents a significant challenge in terms of heat dissipation. Electrically conductive adhesives (ECAs), particularly silver epoxy adhesives, have emerged as a new type of electronic packaging material, thanks to their high conductivity and stable contact resistance. However, while there has been extensive research on silver epoxy adhesives, little attention has been paid to improving their thermal conductivity, which is a critical requirement in the ECA industry. In this paper, we propose a straightforward method for treating silver epoxy adhesive with water vapor, resulting in a remarkable improvement in thermal conductivity to 9.1 W/(m·K), three times higher than the sample cured using traditional methods (2.7 W/(m·K)). Through research and analysis, the study demonstrates that the introduction of H2O into the gaps and holes of the silver epoxy adhesive increases the path of electron conduction, thereby improving thermal conductivity. Furthermore, this method has the potential to significantly improve the performance of packaging materials and meet the needs of high-performance ECAs.

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“…The direct printing of conductive ink has emerged as an important alternative to traditional lithography, which is a complex multistep method for producing conductive thin films or patterns that generates a lot of waste [ 1 ]. Many examples of the use of metallic inks in printed electronics have been reported, such as printed circuit boards [ 2 , 3 , 4 ], light-emitting diodes (LEDs) [ 5 , 6 ], flexible displays [ 7 , 8 ], radio frequency identification (RFID) tags [ 9 , 10 ], solar cells [ 11 , 12 ], and transparent electrodes [ 13 , 14 ].…”

Section: Introductionmentioning

confidence: 99%

Effectiveness of Oxygen during Sintering of Silver Thin Films Derived by Nanoparticle Ink

et al. 2022

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Silver nanoparticle (NP) inks have been widely used in the ink-jet printing field because of their excellent properties during low-temperature sintering. However, the organic dispersant used to prevent the aggregation and sedimentation of NPs can hinder the sintering process and result in the high resistivity of sintered films. In this study, silver thin films derived from silver NP ink with polyvinylpyrrolidone (PVP) dispersant were sintered in different atmospheres of pure nitrogen, air, and pure oxygen. The effect of the oxygen content in the sintering atmosphere on the thermal properties of the ink, the electrical resistivity and microstructure of the sintered films, and the amount of organic residue were studied by using differential scanning calorimetry, the four-point probe method, scanning electron microscopy, Fourier transform infrared spectroscopy, etc. The mechanism of optimizing the film resistivity by influencing the decomposition of the PVP dispersant and the microstructure evolution of the silver thin films through the sintering atmosphere was discussed. The results demonstrated that an oxygen-containing atmosphere could be effective for silver NPs in two ways. First, the oxygen content could enhance the diffusion ability of silver atoms, thus accelerating the stage transition of microstructural evolution at low temperatures. Second, the oxygen content could enable the PVP to decompose at a temperature much lower than in conditions of pure nitrogen, thus helping to finalize the densification of a silver film with a low resistivity of 2.47 μΩ·cm, which is approximately 1.5-fold that of bulk silver. Our findings could serve as a foundation for the subsequent establishment of ink-jet printing equipment and the optimization of the sintering process for printing silver patterns on flexible substrates.

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Characterization of Inkjet-Printed Silver Patterns for Application to Printed Circuit Board (PCB)

Cited by 7 publications

References 16 publications

Mechanical and thermal reliability of conductive circuits inkjet printed on flexible substrates

Mechanical and thermal reliability of conductive circuits inkjet printed on flexible substrates

Improvement in the Thermal Conductivity of Silver Epoxy Adhesive by Treating with Water Vapor

Effectiveness of Oxygen during Sintering of Silver Thin Films Derived by Nanoparticle Ink

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