2012
DOI: 10.1016/j.jallcom.2012.06.104
|View full text |Cite
|
Sign up to set email alerts
|

Characterization of IMC layer and its effect on thermomechanical fatigue life of Sn–3.8Ag–0.7Cu solder joints

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
2
1
1

Citation Types

0
32
1

Year Published

2013
2013
2023
2023

Publication Types

Select...
7
1

Relationship

0
8

Authors

Journals

citations
Cited by 97 publications
(33 citation statements)
references
References 26 publications
0
32
1
Order By: Relevance
“…[20][21][22][23][24] However, in this current study, thin (~2 μm) and uniform IMC layers formed at both interfaces, in spite of the TH test for 500 h (Fig. 6).…”
Section: Resultscontrasting
confidence: 54%
“…[20][21][22][23][24] However, in this current study, thin (~2 μm) and uniform IMC layers formed at both interfaces, in spite of the TH test for 500 h (Fig. 6).…”
Section: Resultscontrasting
confidence: 54%
“…Therefore, it has been considered that an in-situ micro-scale test, e.g. nanoindentation, would be appropriate to obtain Young's modulus and hardness of these IMCs in solder joints at micro-scale [4,[23][24][25]. Furthermore, some works were reported on the fracture characteristics of individual IMCs in solder joints through micro-scale tests.…”
Section: Sn Imcs Formed In Snmentioning
confidence: 99%
“…Comparing to Sn Pb solder alloys, Sn-rich solder alloys have higher melting temperatures and higher Sn contents. Thus, it can react rapidly with a common metallic substrate (Cu), forming thick Cu Sn intermetallic compounds (IMCs) at the interfaces during reflowing and service, which arouses some reliability issues [4][5][6][7].…”
Section: Introductionmentioning
confidence: 99%
See 1 more Smart Citation
“…In recent years, Ag-Sn alloys have aroused great scientific research interest because the Ag rich Ag-Sn alloys show excellent electronic conductivity and the Sn-rich Sn-Ag alloys are idea substitutes for lead-free solders [1][2][3][4][5]. Many investigations reveal that the thermodynamic properties of liquid alloys and the final solid microstructures affect their performance [6][7][8][9][10][11][12][13].…”
mentioning
confidence: 99%