Characterization of IMC layer and its effect on thermomechanical fatigue life of Sn–3.8Ag–0.7Cu solder joints

Che, F.X.; Pang, J.H.L.

doi:10.1016/j.jallcom.2012.06.104

Cited by 95 publications

(30 citation statements)

References 26 publications

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“…[20][21][22][23][24] However, in this current study, thin (~2 μm) and uniform IMC layers formed at both interfaces, in spite of the TH test for 500 h (Fig. 6).…”

Section: Resultscontrasting

confidence: 54%

Effect of Hygrothermal Treatment on Reliability of Thermo-Compression Bonded FPCB/RPCB Contact Joints

Yoon

Jung

2016

Mater. Trans.

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In this study, electrodes on a exible printed circuit board (FPCB) and rigid printed circuit board (RPCB) were bonded together by thermo-compression (TC) bonding, using a Sn-3.0Ag-0.5Cu solder as an interlayer. In order to investigate the hygrothermal reliability of the TC bonded FPCB/RPCB joints, a temperature-humidity (TH) test of 85 C/85% relative humidity, and a 90 peel test, were conducted. The relationships between the TH treatment, peel strength, and failure analysis result were discussed. The peel strength signi cantly decreased as TH time increased. In contrast, a signi cant variation in electrical resistance was not observed during TH testing. Thin and uniform (Ni,Cu) 3 Sn 4 intermetallic compound (IMC) layers were formed at both FPCB/Sn-3.0Ag-0.5Cu/RPCB interfaces. After a TH test for 500 h, the thickness of the IMC layer was slightly increased. In the case of the joint without TH treatment, a fracture occurred at the polyimide of the FPCB. After the TH test, the degradation of the adhesion between the polyimide and Cu in the FPCB occurred, due to the hygrothermal treatment, resulting in a switch of failure mode, from a polyimide failure to a brittle polyimide/Cu interface failure. X-ray photoelectron spectroscopy (XPS) analyses showed that the decrease in C-O and C=O bond ratios caused a decrease in peel strength of the TC bonded FPCB-RPCB joints, after the TH test. When comparing the TH and HTS tests, the TH test signi cantly deteriorated the integrity of the TC bonded FPCB-RPCB joints.

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“…[20][21][22][23][24] However, in this current study, thin (~2 μm) and uniform IMC layers formed at both interfaces, in spite of the TH test for 500 h (Fig. 6).…”

Section: Resultscontrasting

confidence: 54%

Effect of Hygrothermal Treatment on Reliability of Thermo-Compression Bonded FPCB/RPCB Contact Joints

Yoon

Jung

2016

Mater. Trans.

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“…Therefore, it has been considered that an in-situ micro-scale test, e.g. nanoindentation, would be appropriate to obtain Young's modulus and hardness of these IMCs in solder joints at micro-scale [4,[23][24][25]. Furthermore, some works were reported on the fracture characteristics of individual IMCs in solder joints through micro-scale tests.…”

Section: Sn Imcs Formed In Snmentioning

confidence: 99%

“…Comparing to Sn Pb solder alloys, Sn-rich solder alloys have higher melting temperatures and higher Sn contents. Thus, it can react rapidly with a common metallic substrate (Cu), forming thick Cu Sn intermetallic compounds (IMCs) at the interfaces during reflowing and service, which arouses some reliability issues [4][5][6][7].…”

Section: Introductionmentioning

confidence: 99%

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Micro-mechanical and fracture characteristics of Cu 6 Sn 5 and Cu 3 Sn intermetallic compounds under micro-cantilever bending

et al. 2016

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“…In recent years, Ag-Sn alloys have aroused great scientific research interest because the Ag rich Ag-Sn alloys show excellent electronic conductivity and the Sn-rich Sn-Ag alloys are idea substitutes for lead-free solders [1][2][3][4][5]. Many investigations reveal that the thermodynamic properties of liquid alloys and the final solid microstructures affect their performance [6][7][8][9][10][11][12][13].…”

mentioning

confidence: 99%

Thermodynamic properties and microstructural characteristics of binary Ag-Sn alloys

Zhai

Wei

2013

Chin. Sci. Bull.

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The liquidus and solidus temperatures and enthalpy of fusion for Ag-Sn alloys are systematically measured within the whole composition range by differential scanning calorimetry (DSC). The measured enthalpy of fusion is related to Sn content by polynomial functions, which exhibit one maximum value at 52 wt%Sn and two minimum values around 21 wt%Sn and 96.5 wt%Sn, respectively. The liquidus slope, the solidification temperature interval, the solute partition coefficient and the entropy of fusion are calculated on the basis of the measured results. The undercoolability of those liquid Ag-Sn alloys solidifying with primary (Ag) solid solution phase is stronger than the other alloys with the preferential nucleation of  and  intermetallic compounds. Morphological observations reveal that peritectic reactions can rarely be completed, and the peritectic microstructures are always composed of both primary and peritectic phases. Ag-Sn alloy, enthalpy of fusion, undercoolability, peritectic solidification Citation:Zhai W, Wei B B. Thermodynamic properties and microstructural characteristics of binary Ag-Sn alloys. Chin Sci Bull, 2013, 58: 938944,

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Characterization of IMC layer and its effect on thermomechanical fatigue life of Sn–3.8Ag–0.7Cu solder joints

Cited by 95 publications

References 26 publications

Effect of Hygrothermal Treatment on Reliability of Thermo-Compression Bonded FPCB/RPCB Contact Joints

Effect of Hygrothermal Treatment on Reliability of Thermo-Compression Bonded FPCB/RPCB Contact Joints

Micro-mechanical and fracture characteristics of Cu 6 Sn 5 and Cu 3 Sn intermetallic compounds under micro-cantilever bending

Thermodynamic properties and microstructural characteristics of binary Ag-Sn alloys

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