Characterization of Hygroscopic Deformations by Moiré Interferometry

Stellrecht, E.; Han, Bongtae; Pecht, Michael

doi:10.1007/978-1-4419-5719-1_5

Cited by 1 publication

(2 citation statements)

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“…In the same way, for moisture desorption modeling, the initial condition is the residual moisture distribution in the entire package and the boundary condition is w=0 along the outside surface all the time. The material properties needed for moisture diffusion such as moisture diffusion coefficient D and moisture saturated concentration C sat under 85 /85%RH are shown in table 1 [7]. D H (6) where Į is coefficient of thermal expansion (CTE).…”

Section: Finite Element Modelmentioning

confidence: 99%

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Effect of hygro-thermo-mechanical stress on reliability of stacked die package

Zhu

Peng²,

Yang³

2011

2011 International Symposium on Advanced Packaging Materials (APM)

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Mechanical reliability of epoxy molding compounds in plastic packages of integrated circuits (IC) is greatly affected by the compound ability to absorb moisture. In this paper, the hygrothermal effect of a 2-layer stacked die package was investigated which emphasized on the hygroscopic stress and thermal mismatch stress. By finite element analysis (FEA), the distribution of moisture diffusion, thermo-mechanical stress, hygromechanical stress and hygro-thermo-mechanical stress under hygro-thermal environment were simulated and calculated. The simulation results showed that the bottom die-attach endured higher thermal stress after the moisture preconditioning under 85 /85%RH. By simulation of hygroscopic swelling stress during reflow process, it was indicated that the critical position for the package reliability located at the corner of the bottom die and the interface between the bottom die-attach and die. Therefore, the reliability of the bottom layers is relatively low under hygro-thermal environment.

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Section: Finite Element Modelmentioning

confidence: 99%

“…The hygroscopic strain due to swelling can be defined as follows: C h E H (7) where ȕ is CME and C is local moisture concentration. Thus in the above equation the hygroscopic strain can be related to a given wetness distribution.…”

Section: Hygro-mechanical Modelmentioning

confidence: 99%