2022
DOI: 10.3390/met12111946
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Characterization of Hot Workability in AISI 4340 Based on a 3D Processing Map

Abstract: This study performed high-temperature compression tests at the temperature 900 to 1200 °C and strain rate 0.01 to 10 s−1 to characterize the high-temperature deformation behavior of AISI 4340. The constitutive equation of AISI 4340 was expressed using the Arrhenius model and the Zener–Hollomon (Z) parameter. Dynamic Recrystallization (DRX) behavior was evaluated by observing the compressed specimen with Electron Backscatter Diffraction (EBSD). The processing map is based on the dissipation efficiency of the dy… Show more

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Cited by 5 publications
(3 citation statements)
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“…Figure 4 shows the temperature change history measured using a thermocouple attached to the center of the specimen during the compression test. To account for the temperature-corrected flow stress, the temperature and stress relationship proposed by Park et al [32] was linearly interpolated to match the set temperature of the isothermal compression test. To determine the friction-corrected flow stress, the correction method for determining the friction coefficient m, proposed by Ebrahimi et al [34], was adopted.…”
Section: Experiments Resultsmentioning
confidence: 99%
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“…Figure 4 shows the temperature change history measured using a thermocouple attached to the center of the specimen during the compression test. To account for the temperature-corrected flow stress, the temperature and stress relationship proposed by Park et al [32] was linearly interpolated to match the set temperature of the isothermal compression test. To determine the friction-corrected flow stress, the correction method for determining the friction coefficient m, proposed by Ebrahimi et al [34], was adopted.…”
Section: Experiments Resultsmentioning
confidence: 99%
“…The 3D processing map is shown in Figure 7. Stacking 2D processing maps from strain 0.1 to 1.0, according to Park et al [32], the 3D processing map was plotted separately without overlapping η and ξ to increase visibility. According to the color depth, Figure 7a is a 3D power dissipation efficiency map stacked at 0.01 from strain 0.1 to 1.0.…”
Section: Expansion Of Processing Map To Include Accumulated Strainmentioning
confidence: 99%
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