Characterization of Grain Boundary‐Engineered Aluminum–Magnesium Alloys

Abstract

Herein, the effect of sputtering rate on the fraction of special grain boundaries in 5xxx series Al–Mg alloys is explored. Samples are synthesized via interrupted direct current (DC) magnetron sputtering with varying deposition rates, and the grain size and grain boundary character are evaluated with electron backscatter diffraction (EBSD). The highest sputtering rate (7 nm s−1) leads to an increase in the total number of special grain boundaries, ≈1.5× greater than that of the lower rates. Increased thermal energy and enhanced stress relaxation during film growth promote the formation of Σ3 and Σ7 boundaries.

Cold-spray manufacturing of Zn/ZnO nanocomposite targets for ZnO sputtering

“…There are several reasons for the increase in the sputtering rate, especially in the Zn–50%ZnO target. For instance, the interface between the two mixed phases (ZnO NPs and Zn) in the sputtering process may act as a barrier against energy dissipation and localize the kinetic energy of the sputtering ions in a small region on the target surface [25,45]. In addition, using the milling process can increase the density of dislocations and the internal energy of powders.…”