Characterization of Fourth-Generation High-Temperature Discontinuous Fiber Molding Compounds

Krishnamachari, Parakalan; Lou, Jianzhong; Sankar, Jag; Lincoln, Jason E.; Hout, Sara

doi:10.1080/10236660903225452

Cited by 3 publications

(2 citation statements)

References 8 publications

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“…Traditional matrix resins used in composites, such as epoxy resins and bismaleimide resins, are limited to 150~250 °C, which severely limits the application of composites in high-temperature structures and their components [ 36 , 37 , 38 , 39 ]. Polyimide is one of the best high-temperature-resistant matrix materials in resin-based composites, and its multi-generation products can meet the temperature resistance requirement of 300~500 °C, which is currently mainly used in the advanced field of high-temperature-resistant structural components in aircraft [ 40 , 41 ]. The main difference between polyimide composites and traditional composites is that their interface is formed under high-temperature and high-pressure conditions (300~400 °C), which makes the interface formation mode between the polyimide resin matrix and carbon fiber, the interface bond strength, the stress distribution state between the carbon fiber and matrix, etc., significantly different from those of epoxy and bismaleimide resin matrix composites [ 41 , 42 ].…”

Section: Introductionmentioning

confidence: 99%

A Water-Soluble Thermoplastic Polyamide Acid Sizing Agents for Enhancing Interfacial Properties of Carbon Fibre Reinforced Polyimide Composites

Huang,

Zhang,

et al. 2024

Materials

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Carbon-fiber-reinforced polyimide (PI) resin composites have gained significant attention in the field of continuous-fiber-reinforced polymers, in which the interfacial bonding between carbon fiber and matrix resin has been an important research direction. This study designed and prepared a water-soluble thermoplastic polyamide acid sizing agent to improve the wettability of carbon fiber, enhance the van der Waals forces between carbon fiber and resin and strengthen the chemical bonding between the sizing agent and the alkyne-capped polyimide resin by introducing alkyne-containing functional groups into the sizing agent. This study found that the addition of a sizing layer effectively bridged the large modulus difference between the fiber and resin regions, resulting in the formation of an interfacial layer approximately 85 nm thick. This layer facilitated the transfer of stress from the matrix to the reinforced carbon fiber, leading to a significant improvement in the interfacial properties of the composites. Adjusting the concentration of the sizing agent showed that composites treated with 3% had the best interfacial properties. The interfacial shear strength increased from 82.08 MPa to 108.62 MPa (32.33%) compared to unsized carbon fiber. This research is significant for developing sizing agents suitable for carbon-fiber-reinforced polyimide composites.

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Section: Introductionmentioning

confidence: 99%

A Water-Soluble Thermoplastic Polyamide Acid Sizing Agents for Enhancing Interfacial Properties of Carbon Fibre Reinforced Polyimide Composites

Huang,

Zhang,

et al. 2024

Materials

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“…Polyimide-matrix composite (PIMC) is a kind of material with outstanding thermal resistance and stability. 6–9 However, due to the high insulating characteristic of polyimide (PI), PI-matrix PMCs generally exhibit poor electromagnetic shielding property, even with carbon fibers as the reinforcement. As to this situation, surface metallization of the PMC might be an effective solution by forming electrically conductive surface.…”

Section: Introductionmentioning

confidence: 99%

Realization of electromagnetic shielding performance for polyimide-matrix composite by self-metallization

Zhang

Gong

et al. 2021

Journal of Composite Materials

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Electromagnetic shielding performance has been achieved for a polyimide (PI)-matrix composite by the strategy of self-metallization of its thermosetting PI matrix. Self-metallization of the thermosetting PI was realized by silver ion/poly(amic acid) (PAA) precursor ion exchange and thermal reduction. The factors influencing the self-metallization were investigated. The electrical conductivity and integrity for the surface of the PI were achieved by optimization of ion exchange/thermal reduction parameters. The fabricated PI-matrix composite exhibits a maximum electromagnetic interference shielding effectiveness value of 81 dB. Importantly, the electromagnetic shielding performance can be maintained even after heat condition of 300°C. Meanwhile, the surface-metallized PI composite exhibits mechanical property equivalent to the pristine composite, and an Ag/matrix interfacial strength higher than 19.6 MPa. Besides, self-metallization mechanism of the thermosetting PI was investigated.

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Enhancing thermo-oxidative stability of thermoset polyimide composites using nano neodymium oxide particles

Zhang

Bao²,

Dong³

et al. 2021

Journal of Materials Research and Technology

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Characterization of Fourth-Generation High-Temperature Discontinuous Fiber Molding Compounds

Cited by 3 publications

References 8 publications

A Water-Soluble Thermoplastic Polyamide Acid Sizing Agents for Enhancing Interfacial Properties of Carbon Fibre Reinforced Polyimide Composites

A Water-Soluble Thermoplastic Polyamide Acid Sizing Agents for Enhancing Interfacial Properties of Carbon Fibre Reinforced Polyimide Composites

Realization of electromagnetic shielding performance for polyimide-matrix composite by self-metallization

Enhancing thermo-oxidative stability of thermoset polyimide composites using nano neodymium oxide particles

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