Characterization of Embedded and Thinned RF Chips

Yin, Ran; Morath, Helmuth P. E.; Hoyer, Christian; Nieweglowski, Krzysztof; Meier, Karsten; Wagner, Jens; Ellinger, Frank; Bock, Karlheinz

doi:10.23919/empc55870.2023.10418325

2023 24th European Microelectronics and Packaging Conference &Amp; Exhibition (EMPC) 2023

DOI: 10.23919/empc55870.2023.10418325

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Characterization of Embedded and Thinned RF Chips

Ran Yin,

Helmuth P. E. Morath,

Christian Hoyer

et al.

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Characterization of Embedded and Thinned RF Chips

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References 27 publications

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