Characterization of Dual Side Molding SiP Module

Lai, Jin-Yuan; Chen, Tang-Yuan; Wang, Minghan; Shih, Meng-Kai; Tarng, David; Hung, Chih-Pin

doi:10.1109/ectc.2017.113

Cited by 18 publications

(4 citation statements)

References 3 publications

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“…Indeed, the Castro-Macosko model combines two models, (a) cure kinetics and (b) viscosity model and requires time-consuming determination of curing kinetics, 54 but represents a widely used approach and is already implemented in various commercially available software solutions. 55,56 Besides that, more recent approaches exhibit solely time-dependent viscosity development and require no comprehensive cure kinetics characterization by DSC 54,57,58 Apart from the Arrhenius law in eqn (7), the Vogel-Fulcher equation 59 can be used to express the temperature-dependence of the shear viscosity Z 0 at low shear rates:…”

Section: Methodsmentioning

confidence: 99%

Thermo-rheological and kinetic characterization and modeling of an epoxy vitrimer based on polyimine exchange

Lorenz,

Dyer,

Kumru

2024

Soft Matter

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Section: Methodsmentioning

confidence: 99%

Thermo-rheological and kinetic characterization and modeling of an epoxy vitrimer based on polyimine exchange

Lorenz,

Dyer,

Kumru

2024

Soft Matter

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“…Lai et al, [32] studied the rheokinetic characterization of epoxy molding compound (EMC) using Kamal's model and Cross Castro-Mascoko model. The fitted parameters in both models then used for transfer molding simulation by Moldex3D for Dual side System in Package application.…”

Section: Characterization Of Encapsulating Materials For Led and Elec...mentioning

confidence: 99%

A Review of Moldflow and Finite Element Analysis Simulation of Chip Scale Packaging (CSP) for Light Emitting Diode (LED)

Ching

Abdullah

2022

ARFMTS

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LED technology has been evolving aggressively in recent years from incandescent bulb during older days to as small as chip scale package. There is tremendous pressure to stay competitive in the market by optimizing products to next level of performance and reliability with shortest time to market. This changes the conventional way of product design and development to virtual prototyping by means of Computer Aided Engineering (CAE). The objective of the paper is to review challenges in chip scale packaging application in LED technology. The first part of the paper covered the literature survey of Chip Scale Packaging (CSP) in Light Emitting Diodes (LED), CSP architecture challenges, molding process and material for CSP. The findings of literature found that very few researchers had study silicone encapsulations process in CSP for LED in term of material characterization, mold process and simulation. Findings also shows that deployment Computational Fluid Dynamic (CFD) and integration of virtual prototyping using Finite Element Analysis (FEA) in product development in CSP for semiconductor industry had greatly reduced the time to market. However, there are very few papers discuss the application for CSP technology in LED industry. Second objective of the papers is discussion of methodolology in molding material characterization and simulation methodology. CFD helps to simulate the flow pattern of molding material as a function of different temperature, molding parameters settings for voids and displacement. FEA also help to evaluate the deformation of silicone in panel form and enable designer to predict the displacement of devices with different silicone.

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“…Aniszewski’s [ 10 ] research showed that the fluid volume method is always reliable in solving the free surface problem; its error is bounded, even on coarse grids. Lai’s [ 11 ] research shows that the mold filling simulation of Moldex3D showed a good correlation to the mold fronts, which was obtained by the process of short shots and actual void locations. Duan’s [ 12 ] research shows that the filling of different gate locations in the package, in fact, produces cavitation defects at different locations; a gate design with fewer corners in the injection direction also produces fewer cavitations.…”

Section: Introductionmentioning

confidence: 99%

Simulation of Motor Core Gluing Process with Fine Mesh Nets

et al. 2022

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The actual process of using a resin to glue can optimize many shortcomings in the basic traditional process of welding a motor core. For example, the use of a resin for gluing can lead to a reduction in iron loss, improve rigidity, reduce processing times, and improve product quality. When using a gluing method, the biggest challenge is the distribution of the resin; therefore, resin distribution is very much important. This experiment used fine mesh nets to eventually improve the unbalanced state of resin distribution. In this research, in order to predict real flow behavior during gluing, computer-aided engineering was used for computer simulation. The results of the simulation showed that the illustrated trend of the filling process was very much similar to the actual experimental results. The simulation results could mostly predict defects and make effective improvements, which can lead to a significant reduction in the money and time spent on experiments. The simulation results of the dipping process also showed that the distribution of resin with fine mesh nets was more even than without fine mesh nets. Fine mesh nets can eventually improve an over-flow problem, which, ultimately, causes bumps. In this research, a simulation analysis of the gluing process of a motor core with fine mesh nets was conducted, and the results show that the resin distribution and the flow front of the runner were more even than those without fine mesh nets.

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Characterization of Dual Side Molding SiP Module

Cited by 18 publications

References 3 publications

Thermo-rheological and kinetic characterization and modeling of an epoxy vitrimer based on polyimine exchange

Thermo-rheological and kinetic characterization and modeling of an epoxy vitrimer based on polyimine exchange

A Review of Moldflow and Finite Element Analysis Simulation of Chip Scale Packaging (CSP) for Light Emitting Diode (LED)

Simulation of Motor Core Gluing Process with Fine Mesh Nets

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