2017
DOI: 10.1088/1757-899x/219/1/012038
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Characterization of Cu Distribution in an Al-0.3%Cu Alloy Cold Rolled to 98%

Abstract: Abstract. In this study, the distribution of Cu element in a Al (99.9996% purity)-0.3%Cu alloy cold rolled to 98% has been characterized in detail by using three-dimensional atom probe (3DAP) and ChemiSTEM techniques. The cold rolled structure is a typical high strain lamellar structure with an average boundary spacing of 200 nm, indicating a strong role of the small amount of Cu element in stabilizing the microstructure to form the fine scale structure. A heavy segregation of Cu element in the lamellar bounda… Show more

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Cited by 2 publications
(3 citation statements)
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References 24 publications
(30 reference statements)
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“…Nevertheless, after annealing at temperatures higher than 200 ºC, a large number of particles have precipitated in the matrix and at the grain boundaries [28]. The particle density of the 250 ºC annealed sample was measured from SEM electron channeling contrast (ECC) images and the average spacing between the particles was determined to be ~ 1.9 µm.…”
Section: Particlesmentioning
confidence: 99%
“…Nevertheless, after annealing at temperatures higher than 200 ºC, a large number of particles have precipitated in the matrix and at the grain boundaries [28]. The particle density of the 250 ºC annealed sample was measured from SEM electron channeling contrast (ECC) images and the average spacing between the particles was determined to be ~ 1.9 µm.…”
Section: Particlesmentioning
confidence: 99%
“…Distribution of Cu atoms at boundaries in the deformed structure has been investigated by using ChemiSTEM-EDS and APT. According to our previous work [22] , the vast majority of the lamellar structure is free of particles, although a few small particles can be observed lying at the lamellar boundaries. Here, a new example of Cu distribution in the deformed sample combining EDS mapping and TEM characterization is presented in Fig.…”
Section: Cu Distributionmentioning
confidence: 74%
“…Recently, we fabricated an ultrafine lamellar-structured Al-0.3%Cu alloy [21][22][23] by adding 0.3%wt oxygen-free high conductivity copper into a high purity (99.9996%) Al matrix and cold rolling to a thickness reduction of 98%. Our previous post mortem studies have shown that continuous coarsening of the deformed lamellar structure takes place during recovery annealing [21] and that the segregation of Cu solutes and subsequent precipitation of Al 2 Cu particles preferentially occur at the lamellar boundaries [ 21 , 22 ].…”
Section: Introductionmentioning
confidence: 99%