Characterization of ABF/Glass/ABF Substrates for mmWave Applications

Rehman, Mutee ur; Ravichandran, Siddharth; Watanabe, Atom O.; Erdogan, Serhat; Swaminathan, Madhavan

doi:10.1109/tcpmt.2021.3061485

Cited by 36 publications

(9 citation statements)

References 28 publications

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“…Compared to vector network analyzers (VNA), another instrument employed in Ref. [18] to measure the dielectric properties of materials in the 5G band, the higher frequency resolution thus enabled, is of little interest due to the rather featureless nature of ε(ν) in the THz band [1,19]. The system produces quasisingle-cycle THz pulses at a repetition rate of 100 MHz.…”

Section: Method: Experimental Setup and Signal Processingmentioning

confidence: 99%

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Terahertz Dielectric Characterization of Low-Loss Thermoplastics for 6G Applications

Zhai

Locquet

Citrin

2022

Int J Wireless Inf Networks

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Common thermoplastics, namely, polycarbonate (PC), poly (methyl methacrylate) (PMMA), and acrylonitrile butadiene styrene (ABS) are low-cost materials with potential applications in emerging 6G communications systems, ranging from microelectronics packaging to metasurfaces for reflectors and filters. In addition, low-loss materials are also needed for more pedestrian applications, such as packaging for entire handheld devices, subassemblies, and high-frequency windows where low-cost is key and long lifetime might not be a requirement. In this work, we utilize terahertz time-domain spectroscopy from 500 GHz to 2 THz to characterize the dielectric properties and loss tangent for each thermoplastic above. The plastics investigated have refractive index (∼1.6-1.7) in the 6G band with low dispersion. The absorption, however, increases at high frequencies as is common in disordered materials, highlighting a key challenge for 6G. Nonetheless, in absolute terms, all the thermoplastics studied present lowloss performance compared with (higher-index) common glasses and ceramics within the entire frequency range, suggesting that they are promising candidates for selected applications for future 6G systems.

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Section: Method: Experimental Setup and Signal Processingmentioning

confidence: 99%

“…In Refs. [16][17][18], polymer films were laminated on both sides of glass substrate to explore the use of this stackup as a microelectronics substrate and to fabricate waveguides and transmission lines. Loss tangent tan δ ≈ 0.01 were measured in the 50-140 GHz range, barely touching the 6G band.…”

Section: Introductionmentioning

confidence: 99%

Terahertz Dielectric Characterization of Low-Loss Thermoplastics for 6G Applications

Zhai

Locquet

Citrin

2022

Int J Wireless Inf Networks

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“…In order to reduce the energy loss at 5G and higher frequencies, Rehman et al. [76] prepared an ABF/Glass/ABF substrate by laminating 15 μm BF on both sides of a 100 μm glass core. The results showed that the dielectric loss of ABF/Glass/ABF substrate was as low as 0.004, 0.009 and 0.012 at 23, 103, and 140Ghz, respectively.…”

Section: Polymer‐based Nanocompositesmentioning

confidence: 99%

Polymer‐based nanocomposites in semiconductor packaging

Sun

2023

IET Nanodielectrics

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Semiconductor packaging materials play a critical role in the development of semiconductor devices. They not only provide reliable protection and support, but also contribute to the electrical connection between the chip and the external circuit. Among many choices of packaging materials, polymer‐based nanocomposites have become the mainstream candidate due to their low cost, easy processability, and tunable properties. Materials with low dielectric constant and dielectric loss, high glass transition temperature, fast thermal conductivity, suitable coefficient of thermal expansion, low viscosity, and good processability are commonly required in semiconductor packaging, yet most polymers do not meet these criteria. Therefore, modulation of the polymer matrix, introduction of suitable fillers, and modification of the filler surface are often effective approaches to enhance the performance of the composites. Here, the authors first review current research progresses of polymer‐based nanocomposites for five different types of packaging applications, namely moulding compounds, thermal interface materials, underfills, die attach materials, and substrates. The authors then present prospects of developing next‐generation polymer‐based nanocomposites for advanced semiconductor packaging and propose some suggestions to solve the existing challenges.

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“…One example in this area is the use of glass interposers, in addition to Si interposers, due to the electrical advantages of certain glass materials. An overview of different materials for package-integrated RF applications is reviewed in [4] and [5]. Another consequence of the introduction of novel materials and complex dimensions/shapes to packaging has been to investigate and assess alternate manufacturing methods compared to traditional package and die manufacturing processes, such as additive manufacturing (AM).…”

Section: Technologiesmentioning

confidence: 99%