2021
DOI: 10.1016/j.microrel.2020.114023
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Characterization method of IGBT comprehensive health index based on online status data

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Cited by 8 publications
(7 citation statements)
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“…The studies [ 6 , 7 , 8 , 9 , 10 , 11 , 12 , 13 , 14 , 15 , 16 , 17 , 18 , 19 , 20 , 21 , 22 , 23 , 24 ] show that the IGBT failure precursor parameters can directly or indirectly reflect the health state of the IGBT, mainly including collector-emitter voltage (V CE ), gate-emitter threshold voltage (V GEth ), collector shutdown current (I C ), gate leakage current (I G ), junction temperature and thermal resistance, etc.…”
Section: Analysis Of Igbt Failure Modes and Their Precursor Parametersmentioning
confidence: 99%
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“…The studies [ 6 , 7 , 8 , 9 , 10 , 11 , 12 , 13 , 14 , 15 , 16 , 17 , 18 , 19 , 20 , 21 , 22 , 23 , 24 ] show that the IGBT failure precursor parameters can directly or indirectly reflect the health state of the IGBT, mainly including collector-emitter voltage (V CE ), gate-emitter threshold voltage (V GEth ), collector shutdown current (I C ), gate leakage current (I G ), junction temperature and thermal resistance, etc.…”
Section: Analysis Of Igbt Failure Modes and Their Precursor Parametersmentioning
confidence: 99%
“…Due to the decline in V CE caused by chip bonding and the loss of bonding wires, the increase in V CE value has a high impact, and it is generally believed that the V CE value increases as IGBT ages. The V CE is the most commonly used health monitoring parameter due to its easy detection of V CE through sensors under laboratory conditions [ 13 , 14 , 15 , 16 , 17 , 18 , 19 , 20 ]. The part of the shutdown current I C in the slow falling phase of the IGBT is called the tail current, and the shutdown current duration can be used as a performance parameter to characterize the IGBT latch-up effect, so the tailing current can also be used as an electrical parameter to characterize the IGBT latch-up effect.…”
Section: Analysis Of Igbt Failure Modes and Their Precursor Parametersmentioning
confidence: 99%
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“…However, IGBT devices usually must operate under overheating, overload, and other conditions. They are affected by thermal, electrical, and environmental stress, which will damage the device's fatigue, causing device failure and thereby causing harm to the entire power system [3,4]. Therefore, it is vital to study the remaining useful life (RUL) prediction of IGBT devices to reduce the failure probability of the power system and realize its safe and stable operation [5].…”
Section: Introductionmentioning
confidence: 99%