Characterization and properties of TiN-containing amorphous Ti–Si–N nanocomposite coatings prepared by arc assisted middle frequency magnetron sputtering

Zou, Chen; Wang, H.J.; Li, M.; Yu, Yi; Liu, C.S.; Guo, Liping; Fu, Donglei

doi:10.1016/j.vacuum.2009.10.050

Cited by 33 publications

(11 citation statements)

References 20 publications

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“…e and 2f, both films showed similar location to the reported value of Si 3 N 4 at 101.6 eV, indicating that Si represented as nitride state of Si 3 N 4 rather than formation of silicon oxides in the annealed films. Figures g and 2h show the spectrum of Cu 2p, the peaks located at 932.58 eV, 933.1 eV, 952.68 eV and 953.1 eV . It is easier for Al and Ti to diffuse outwards and form dense Al 2 O 3 protective layer and TiO 2 in the surface, the content of Cu in our samples is very low and distributed irregularly in the lattice, so it is difficult for Cu to catch O and formed Cu 2 O.…”

Section: Resultsmentioning

confidence: 80%

Influence of thermal annealing on the microstructure, hardness and corrosion behavior of TiAlSiCuN nanocomposite films

Shi

Wan

Wang

et al. 2016

Surface & Interface Analysis

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Nanocomposite TiAlSiCuN films were deposited on high speed steels by filtered magnetic arc ion plating. Detailed properties of the films annealed at various temperatures are studied. After thermal annealing at different temperatures ranging from 400 to 800 °C, changes in the film micro‐structure, chemical and phase composition, surface morphology, hardness and polarization curve properties were systematically characterized by X‐ray diffraction, X‐ray photoelectron spectroscopy, scanning electron microscopy, nano‐indenter and electrochemical workstation, respectively. It was found that the TiAlSiCuN films could be fully oxidized at 800 °C, Al and Ti atoms all diffused outwards and formed dense protective Al2O3 and TiO2 layer. Simultaneously, the TiAlN phase gradually disappeared. The films annealed at 400 °C obtained the highest hardness because of the certain grain growth and little generated oxides. Besides, the certain formation of dense protective Al2O3 layer made the TiAlSiCuN film annealed at 600 °C present the least corrosion current density and the corrosion voltage. Copyright © 2016 John Wiley & Sons, Ltd.

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Section: Resultsmentioning

confidence: 80%

Influence of thermal annealing on the microstructure, hardness and corrosion behavior of TiAlSiCuN nanocomposite films

Shi

Wan

Wang

et al. 2016

Surface & Interface Analysis

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“…The chemical bonding states are obtained by subtracting the background with the Shirley’s method and deconvoluting the spectra by a curve-fitting method using a non-linear least squares fitting to a mixed Gaussian–Lorentzian product function [ 20 ]. The bonding status of Ti is investigated and shown in Figure 3 a, peaks with binding energy of 453.9 and 456.2 eV are assigned to Ti 2p3/2 stoichiometric TiN and TiO x , respectively [ 21 ]. The binding energy of 459.7 eV and 462 eV are related to Ti 2p1/2 –N and Ti 2p1/2 –O.…”

Section: Resultsmentioning

confidence: 99%

Influence of N2 Partial Pressure on Structure and Mechanical Properties of TiAlN/Al2O3 Multilayers

et al. 2013

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TiAlN/Al2O3 multilayers with different Ar/N2 ratios were deposited on Sisubstrates in different N2 partial pressure by magnetron sputtering. The crystalline and multilayer structures of the multilayers were determined by a glancing angle X-ray diffractometer (XRD). A nanoindenter was used to evaluate the hardness, the elastic modulus and scratch scan of the multilayers. The chemical bonding was investigated by a X-ray Photoelectron Spectroscopy (XPS). The maximum hardness (36.3 GPa) and elastic modulus (466 GPa) of the multilayers was obtained when Ar/N2 ratio was 18:1. The TiAlN/Al2O3 multilayers were crystallized with orientation in the (111) and (311) crystallographic planes. The multilayers displayed stably plastic recovery in different Ar/N2 ratios. The scratch scan and post scan surface profiles of TiAlN/Al2O3 multilayers showed the highest critical fracture load (Lc) of 53 mN for the multilayer of Ar/N2 = 18:1. It indicated that the multilayer had better practical adhesion strength and fracture resistance.

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“…The N1s spectrum of the nanocomposite coatings [Fig. (d)] shows the typical characteristic of nitride TiN and Si 3 N 4 coatings with binding energies at around 396.2 and 397.0 eV, respectively . The broad N1s spectra [Fig.…”

Section: Resultsmentioning

confidence: 99%

Nanocomposite Ti–Si–N Coatings Deposited by Reactive dc Magnetron Sputtering for Biomedical Applications

2011

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Nanocomposite Ti–Si–N coatings were prepared by reactive dc magnetron sputtering in a mixture of Ar and N2 gases onto bio implantable 316L stainless steel substrates. X‐ray diffraction analysis revealed that the Ti–Si–N nanocomposite coatings are mainly composed of amorphous Si3N4 and TiN crystals. The presence of different phases like TiN, TiO2, and Si3N4 was confirmed from X‐ray photoelectron spectroscopy analysis. Raman spectra of the as‐deposited composite coatings exhibited characteristic peaks at 207.5, 305.8, 442.5, and 571.8 cm−1. HRTEM indicated columnar microstructure. A higher hardness value of 35 GPa for the nanocomposite coatings was observed. The potentiodynamic polarization and electrochemical impedance spectroscopy measurements showed that the Ti–Si–N nanocomposite coatings exhibited superior corrosion resistance compared with the Si3N4, TiN single layer, and the bare substrate in simulated body fluid solution.

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Characterization and properties of TiN-containing amorphous Ti–Si–N nanocomposite coatings prepared by arc assisted middle frequency magnetron sputtering

Cited by 33 publications

References 20 publications

Influence of thermal annealing on the microstructure, hardness and corrosion behavior of TiAlSiCuN nanocomposite films

Influence of thermal annealing on the microstructure, hardness and corrosion behavior of TiAlSiCuN nanocomposite films

Influence of N2 Partial Pressure on Structure and Mechanical Properties of TiAlN/Al2O3 Multilayers

Nanocomposite Ti–Si–N Coatings Deposited by Reactive dc Magnetron Sputtering for Biomedical Applications

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