2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and 2024
DOI: 10.1109/eurosime60745.2024.10491441
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Characterization and Modeling of Cure-Induced Thermo Mechanical Properties and Chemical Shrinkage of Epoxy Resins

Venu Prakash Kasinikota,
Wolfgang Muehleisen,
Markus Grinschgl
et al.
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