“…Similar devices, consisting of multiple pairs of heated wires, integrated on the same chip by means of dedicated micromachining technologies, have been proposed for 2D [8][9][10] and 3D [11][12][13] APV measurements. Recently, the possibility of fabricating APV sensors with a CMOS-compatible fabrication technique has been demonstrated [14][15][16]. APV sensors have been proposed for diverse applications, including acoustic impedance and absorption coefficient measurement [17][18][19], sound intensity measurement [20], direction of arrival estimation [21], near-field acoustic holography [22,23] and noise source localization [24].…”