Abstract:With the advent of the 5G information age, the production and processing of computer chips has attracted people's attention. In order to adapt to the rapid development in the field of chip manufacturing, high requirements are placed on chemical mechanical planarization (CMP). Among them, the porous structure on the surface of the polishing pad is easily blocked and loses its performance during the use of the polishing pad. Therefore, the use of diamond disc conditioner to dress the polishing pad in the CMP pro… Show more
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