High density plasma etching of indium zinc oxide ͑IZO͒ thin films was performed in HBr/Ar gas mix. As HBr concentration increased, the etch rate was decreased and etch profile was improved. The high degree of etch anisotropy was achieved with decreasing dc-bias voltage and increasing gas pressure. The formation of protective layer, which had a strong effect on the etch profile, was confirmed by surface analyses. The X-ray photoelectron spectroscopy revealed the formation of InBr 3 and ZnBr 2 compounds. It could be concluded that the etching of IZO films in HBr/Ar plasma was governed by ion sputtering along with chemical assistance.Transparent conducting oxide ͑TCO͒ thin films such as indium tin oxide ͑ITO͒, fluorine-doped tin oxide, zinc oxide, and tin oxide films are extensively used as transparent electrodes in solar cells, gas sensors, and flat panel displays, including thin films transistor liquid crystal displays, plasma display panels, and thin-film electroluminescent display devices. 1-4 In particular, ITO thin films are generally used for these applications. However, in order to have high transmittance of 80-90% and low resistivity of 2-4 ϫ 10 −4 ⍀ cm, these thin films should be heat treated at a temperature above 300°C. 1 In addition, high temperature annealing of ITO films limits fabrication of devices on plastic substrates.Recently, it has been reported that new TCO thin films such as indium zinc oxide ͑IZO͒ can be realized with high transmittance and low resistivity without heat treatment at high temperature. 1-3 Owing to the capability of processing at low temperature, IZO thin film is a prospective electrode that can be applied to flexible display devices and solar cells using polycarbonate and polyethyleneterephlate as well as conventional devices requiring TCO films. As the critical dimensions of the devices shrink, a dry etching process for IZO thin films should be developed. Studies on the etching of ITO and ZnO thin films using Cl 2 and CH 4 chemistries have been reported. [5][6][7] Recently, dry etching of IZO films was carried out using various gases containing Cl 2 , CH 4 /H 2 , IBr and BI 3 . 8-10 However, there have been no reports on the etching of IZO thin films using HBr/Ar chemistry.In this study, the etch characteristics of IZO thin films patterned by a photoresist ͑PR͒ were investigated using inductively coupled plasma reactive ion etching ͑ICPRIE͒ in a HBr/Ar gas mix. Atomic force microscopy ͑AFM͒ and X-ray photoelectron spectroscopy ͑XPS͒ were employed to elucidate the etch mechanism of IZO thin films.
ExperimentalIZO thin films with a thickness of 300 nm were prepared on a Si substrate using radio frequency ͑rf͒ magnetron sputtering under an O 2 /Ar gas mix. An In 2 O 3 -ZnO ceramic target with a ratio of 9:1 was employed and the films were deposited at room temperature. The deposited films were patterned by conventional lithography using a PR of 1.2 m thickness.The etching of IZO films was carried out using a commercial ICPRIE equipment ͑A-Tech System, Korea͒ which can generate a...