Characteristics of grain boundary migration and sliding during fatigue of high purity lead

Creep phenomena in lead-free solders

“…3a) and with (Fig. 1,[28][29][30][31] This process leads to formation of stress concentration near obstacles for sliding, namely triple grain joints and inclusions of hard particles at the grain/phase boundaries. The serrated form of the deformation curve is due to breaks of massive slip bands through a thin copper layer.…”