Characteristics of exhaust gas, liquid products, and residues of printed circuit boards using the pyrolysis process

Chiang, Hung‐Lung; Lo, Cho-Ching; Ma, Sen-Yi

doi:10.1007/s11356-009-0245-y

Cited by 27 publications

(11 citation statements)

References 25 publications

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“…Dettmer et al observed large amount of BPhs (up to 17%) from thermal degradation of TBBPA. Enhanced BPh levels at 1.3–14.5 mg kg –1 were observed in the pyrolysis of printed circuit boards with a temperature increase from 300 to 500 °C, 2–3 orders of magnitude lower than pyrolysis at 600 °C (1280 mg kg –1 ) but comparable with those at 850 °C (4.7 mg kg –1 ) . These reported results are compatible with the data in the present study.…”

Section: Results and Discussionsupporting

confidence: 92%

“…The significant higher O/I mass ratios of TBBPA from printed circuit boards than from plastic casings also demonstrated that sample matrices and FR-adding types (additive or reactive) can influence on emissions. Reactive TBBPA in printed circuit boards are chemically bonded to the resins, where TBBPA need to be formed from pyrolyzing brominated epoxy resin first in pyrolysis process, and therefore, are less facile to release and subject to less degradation than additive TBBPA and other additive FRs in ABS and HIPS, which are elementary components of plastic casings. Moreover, several O/I mass ratios for HBCD were larger than 1, implicating for potential formation of HBCD from rearrangement of interisomers and unknown sources during treatment processes.…”

Section: Results and Discussionmentioning

confidence: 99%

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Emissions and Occupational Exposure Risk of Halogenated Flame Retardants from Primitive Recycling of E-Waste

Pei

et al. 2019

Environ. Sci. Technol.

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The production and usage of non-polybrominated diphenyl ether (PBDE) halogenated flame retardants (HFRs) have substantially increased after the ban of several PBDEs. This has resulted in widespread environmental occurrence of non-PBDE HFRs, further amplified by emissions from primitive recycling of obsolete electronics (e-waste). The present study conducted chamber experiments to characterize 15 HFRs (∑15HFR) from thermal treatment and open burning of typical e-waste. Emission factors of ∑15HFR from thermal treatment were 2.6 × 104–3.9 × 105 ng g–1, slightly higher than those from open burning (8.8 × 103–1.0 × 105 ng g–1). Greater output over input mass ratios of ∑15HFR were obtained in thermal treatment than in open burning. Particulate and gaseous HFRs dominated the emissions in thermal treatment and open burning, respectively, largely because of the different temperatures used in the two processes. Particulate HFRs were primarily affiliated with fine particles (D p < 1.8 μm) peaking at 0.56–1.0 or 0.32–0.56 μm in both thermal treatment and open burning. Occupational exposure to most FRs was relatively low, but several PBDEs may pose potential health risk to workers in e-waste home-workshops. Potentially accruing emissions and health risks of non-PBDE HFRs from primitive recycling of e-waste remain a great concern.

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Section: Results and Discussionsupporting

confidence: 92%

Section: Results and Discussionmentioning

confidence: 99%

Emissions and Occupational Exposure Risk of Halogenated Flame Retardants from Primitive Recycling of E-Waste

Pei

et al. 2019

Environ. Sci. Technol.

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“…Chiang et al (Chiang and Lin, 2014;Chiang et al, 2010) carried out the pyrolysis of crushed WCB between 200 and 500 ºC and analyzed the composition of residue, liquid and gaseous fractions. Chien et al (Chien et al, 2000) studied the distribution of Br in pyrolysis products by using a fixed-bed reactor at 350 -800 ºC and thermogravimetry, and found that it mainly evolved as HBr and bromobenzene in the product gas.…”

Section: Introductionmentioning

confidence: 99%

Pollutant emissions during pyrolysis and combustion of waste printed circuit boards, before and after metal removal

García

Conesa

Moltó

et al. 2014

Science of The Total Environment

100

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The constant increase in the production of electronic devices implies the need for an appropriate management of a growing number of waste electrical and electronic equipment.Thermal treatments represent an interesting alternative to recycle this kind of waste, but particular attention has to be paid to the potential emissions of toxic by-products. In this study, the emissions from thermal degradation of printed circuit boards (with and without metals) have been studied using a laboratory scale reactor, under oxidizing and inert atmosphere at 600 and 850 ºC. Apart from carbon oxides, HBr was the main decomposition product, followed by high amounts of methane, ethylene, propylene, phenol and benzene. The maximum formation of PAHs was found in pyrolysis at 850 ºC, naphthalene being the most abundant. High levels of 2-, *Corresponding author. E-mail: ja.conesa@ua.es. Phone: +(34)965903400 Fax: +(34)965903826 2 4-, 2,4-, 2,6-and 2,4,6-bromophenols were found, especially at 600 ºC. Emissions of PCDD/Fs and dioxin-like PCBs were quite low and much lower than that of PBDD/Fs, due to the higher bromine content of the samples. Combustion at 600 ºC was the run with the highest PBDD/F formation: the total content of eleven 2,3,7,8-substituted congeners (tetra-through heptaBDD/Fs) was 7240 and 3250 ng WHO 2005 -TEQ/kg sample, corresponding to the sample with and without metals, respectively.

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“…), formaldehyde (CH 2 O), glyoxylic acid (C 2 H 2 O), 4,4-methyldiphenol (C 13 H 12 O 2 ), etc. 24 According to the local simulation results, the sources of small molecule pyrolysis products of aromatic amine cured epoxy resin, such as CO In the heating stage, only the cross-linked structure breaks and a small number of macromolecular fragments appear in the pure epoxy resin system. When the system temperature is close to 1700 K, small molecular products begin to appear.…”

Section: Statistics and Analysis Of Main Pyrolysis Productsmentioning

confidence: 99%

Reactive molecular dynamics simulation on the pyrolysis characteristics of epoxy resin under the effect of partial discharge active products

Xing

Chi

Xiao

2020

High Performance Polymers

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Aromatic amine cured Bisphenol F epoxy resin is used as a pivotal solid insulation material in electrical equipment at low temperature and extreme environment. Partial discharge (PD) can lead to an increase in local temperature, which leads to pyrolysis, and the existence of PD active products will aggravate the pyrolysis process of insulating materials. In order to investigate the effect of PD active products on the pyrolysis characteristics of aromatic amine cured epoxy resin, the pyrolysis process of epoxy resin under partial discharge active products is simulated based on ReaxFF. The types and changing trend of small molecular products and the mechanism of PD active products acting on the pyrolysis process of epoxy resin are analyzed. The results show that the oxidation of hydroxyl and C-N bridge bonds by PD active products is the main reason for accelerating the pyrolysis of epoxy resin, which changes the main pyrolysis path of epoxy resin cross-linked structure. The thermal stability of cross-linked epoxy resin decreases under the action of active products, and the types and change trend of small molecular products generated in the pyrolysis process also changes greatly with the change of pyrolysis path.

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Characteristics of exhaust gas, liquid products, and residues of printed circuit boards using the pyrolysis process

Cited by 27 publications

References 25 publications

Emissions and Occupational Exposure Risk of Halogenated Flame Retardants from Primitive Recycling of E-Waste

Emissions and Occupational Exposure Risk of Halogenated Flame Retardants from Primitive Recycling of E-Waste

Pollutant emissions during pyrolysis and combustion of waste printed circuit boards, before and after metal removal

Reactive molecular dynamics simulation on the pyrolysis characteristics of epoxy resin under the effect of partial discharge active products

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