Characteristics of a SiC MOSFET-based Double Side Cooled High Performance Power Module for Automotive Traction Inverter Applications

Pai, Ajay Poonjal; Ebli, Michael; Simmet, Tobias; Lis, Adrian; Beninger-Bina, Markus

doi:10.1109/itec53557.2022.9813878

Cited by 3 publications

(1 citation statement)

References 6 publications

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“…To enable accurate and realistic analyses, specific material properties shown in Table 1, have been assigned to the various layers of the DSC module. In Figure 8, each layer represents a distinct component of the DSC module, such as TIMs, spacers, Silicon Carbide (SiC) chips, solders, and substrate layers (copper and ceramic) [70]. By assigning appropriate material properties to these individual layers, their thermal behavior during the simulation process has been accurately modelled.…”

Section: Virtual Setup Thermal Performance Assessment Of Dual Side Co...mentioning

confidence: 99%

An Innovative Additively Manufactured Design Concept of a Dual-Sided Cooling System for SiC Automotive Inverters

Abramushkina,

Martin,

Sen

et al. 2024

IEEE Access

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Modern Electric Vehicles (EVs) require high power and high efficient powertrains to extend their power range. A key element of the electric powertrain is its drive with an electric machine controlled by a traction inverter. A cooling system dissipates heat generated due to the losses in this inverter and keeps its temperature within limits, i.e. below the operational maximum value. Indirect cooling systems are often the preferred solution due to their easy implementation and robust separation of the electric/electronic parts and the coolant circuit. Indirect cooling comes with additional surface interfaces, hence thermal barriers and increased thermal resistance for the losses' heat flow path. One way to increase the system's heat transfer coefficient is by implementing power electronics with dual-sided cooling (DSC) solutions and by enhancing surface structures for the cold plates. Manufacturing complex cold plate solutions with internal surfaceenhancing structures by way of classical techniques (e.g. aluminum extrusion with CNC machining) can be difficult, costly, or even not possible. Sealed one-piece solutions are preferred, without the need to weld parts or use screws, glue, gaskets, etc. 3D metal printing allows to manufacture of a one-unit compact, light, and reliable cold plate. This study shows the advantages and limitations of a 3D metal-printed inverter cold plate by presenting the microchannel design, numerical thermal simulations, and experimental results for the liquid cooled DSC SiC and Si inverters. This work explores the compatible use of 3D metal printing solutions, which will aid the development of modern high-power density EVs.

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Section: Virtual Setup Thermal Performance Assessment Of Dual Side Co...mentioning

confidence: 99%

An Innovative Additively Manufactured Design Concept of a Dual-Sided Cooling System for SiC Automotive Inverters

Abramushkina,

Martin,

Sen

et al. 2024

IEEE Access

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show abstract

SiC MOSFET-Based High Performance Double Side Cooled Module and Compact Cooler for High Power-Density Automotive Inverter Applications

Pai

Widhalm

Ebli

et al. 2022

2022 IEEE International Workshop on Integrated Power Packaging (IWIPP)

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Analysis and Design Optimization of Tilted Rounded-Rectangular Pin-Fins Heat Sink for xEV Double-Sided Cooling Power Module

Cho,

Pyun,

Yoon

2024

IEEE J. Emerg. Sel. Topics Power Electron.

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Characteristics of a SiC MOSFET-based Double Side Cooled High Performance Power Module for Automotive Traction Inverter Applications

Cited by 3 publications

References 6 publications

An Innovative Additively Manufactured Design Concept of a Dual-Sided Cooling System for SiC Automotive Inverters

An Innovative Additively Manufactured Design Concept of a Dual-Sided Cooling System for SiC Automotive Inverters

SiC MOSFET-Based High Performance Double Side Cooled Module and Compact Cooler for High Power-Density Automotive Inverter Applications

Analysis and Design Optimization of Tilted Rounded-Rectangular Pin-Fins Heat Sink for xEV Double-Sided Cooling Power Module

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