Characteristics of a packaged laser‐diode module without band‐stop resonance

Abstract

ABSTRACT:Circuit parameters for an equivalent circuit model of a laser diode were extracted with an impedance analyzer. Impedance matching can be achieved by eliminating inductive components of the leads in the package by using lumped chip capacitors, whereas it shows resonance dip in the low-frequency band.

Simple signal path technique for matching circuit in packaged semiconductor diode laser

“…5 verifies the SPICE simulation where the bandwidth is more than 6 GHz with the curve flattened in 1.7 dB up to 2.9 GHz. This result is also compatible to the similar previous experimental one, though the former result shows much smaller bandwidth of 2.3 GHz without internal package modification (it was only performed with simple reduction in lead length), in that the 3-dB bandwidth extension was achieved by shortening lead length of the TO package [4]. Finally, the flow processes of the package change, circuit improvement, and simulations results are summarized in Fig.…”

“…To date, many experimental and/or theoretical researches in high bit rate transmission systems offered the way of impedance matching to the laser module for various types of packaging [1,2]. However, conventional method for parameter extraction of laser package was a relatively complicated procedure with measuring and fitting the characteristics of scattering parameters (S-parameters) [3,4]. Furthermore, they had ignored the parasitic components of the packages by inserting just series chip resistor or had used the distributed type elements by designing stub transformers which could be used in specified band applications [5][6][7][8][9].…”