2010
DOI: 10.1016/j.resconrec.2009.12.011
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Characteristic of low-temperature pyrolysis of printed circuit boards subjected to various atmosphere

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Cited by 101 publications
(32 citation statements)
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“…The temperature region in which the HBr was released from BFRs was between 200 and 300°C. It has been reported that in traditional thermal degradation process, BFRs was decomposed from 297°C to 400°C [27]. Hence, compared with the traditional thermal degradation process, the degradation temperature region of BFRs can be obviously reduced under the SBWO reaction conditions.…”
Section: Debromination Behavior Of Waste Pcbs In Sbwo Co-treatmentmentioning
confidence: 99%
“…The temperature region in which the HBr was released from BFRs was between 200 and 300°C. It has been reported that in traditional thermal degradation process, BFRs was decomposed from 297°C to 400°C [27]. Hence, compared with the traditional thermal degradation process, the degradation temperature region of BFRs can be obviously reduced under the SBWO reaction conditions.…”
Section: Debromination Behavior Of Waste Pcbs In Sbwo Co-treatmentmentioning
confidence: 99%
“…3, in which PCBs are treated under horizontal rotating equipment at temperature from 240 to 280 °C to separate solder, transistors, capacitors and circuit boards. Within this range of temperature, only solders are melt while the rests are restricted weight loss [43]. The outputs per tonne of treated PCBs from this process consist of approximately 44 kg of solder metals, 176 kg of average and small components (e.g., chips, transistors, small capacitors), 100 kg of the second largest size components (7) Adding sodium bisulfite to the solution∶ 2AuCl 3 (5), (5*), (6) and (7) Table 3 (e.g., capacitors) and the rest is the largest parts: boards (after removal of components) at the amount of 680 kg.…”
Section: Pcb Treatmentmentioning
confidence: 99%
“…were disassembled, the PCBs were first cut into 10 cm × 2 cm pieces and then pretreated by thermal shock process followed the methods of Li et al [27] with minor modifications. Thermal shock process was carried out at 270 • C for 30 min in a tubular type muffle furnace for the improvement of crushing performance.…”
Section: Materials and Sample Preparationmentioning
confidence: 99%