Characterisation of insulated Cu wire ball bonding

Leong, H. Y.; Yap, Boon Kar; Khan, N.; Ibrahim, Mohd Rusli; Tan, L.C.; Faiz, Muhammad Khairi

doi:10.1179/1432891714z.0000000001019

Cited by 3 publications

(4 citation statements)

References 11 publications

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“…Insulated Cu wire is composed of a Cu wire core and an insulation coating. This insulation coating serves the purpose of preventing short circuits and oxidation issues in Cu wire, making insulated Cu wire technology a potential solution for fine and ultra-fine-pitch wire-bonding applications [ 32 ]. Due to only adding a layer of insulation coating on the Cu wire, the conductivity of insulated Cu wire is close to that of bare Cu wire.…”

Section: Types Of Cu-bonding Wirementioning

confidence: 99%

Copper Wire Bonding: A Review

et al. 2023

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This paper provides a comprehensive review on copper (Cu) wire bonding. Firstly, it introduces the common types of Cu wire available in the market, including bare Cu wire, coated Cu wire, insulated Cu wire, and alloyed Cu wire. For each type, their characteristics and application areas are discussed. Additionally, we provide detailed insights into the impact of Free Air Ball (FAB) morphology on bonding reliability, including its effect on bond strength and formation mechanisms. Next, the reliability of Cu wire bonding is analyzed, with a focus on the impact of intermetallic compounds and corrosion on bonding reliability. Specifically, the formation, growth, and stability of intermetallic compounds at bonding interfaces are discussed, and their effects on bonding strength and reliability are evaluated. The detrimental mechanisms of corrosion on Cu wire bonding and corrosion inhibition methods are also analyzed. Subsequently, the applications of simulation in Cu wire bonding are presented, including finite element analysis and molecular dynamics simulations, which provide important tools for a deeper understanding of the bonding process and failure mechanisms. Finally, the current development status of Cu wire bonding is summarized, and future research directions are discussed.

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Section: Types Of Cu-bonding Wirementioning

confidence: 99%

Copper Wire Bonding: A Review

et al. 2023

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“…Another group of researchers have performed study on the process optimization for fine pitch insulated Cu wire bonding with wire diameter of 20 µm. The study demonstrates that fine pitch insulated Cu wire bonding has comparable ball bond and stitch bond quality and reliability performance compared to bare Cu wire, offering great potential for high pin counts Ball Grid Area (BGA) package [3][4].…”

Section: Introductionmentioning

confidence: 98%

“…To date, past researchers have performed various studies in terms of process optimization and reliability of the conventional bonding wires and insulated wires [2][3]. With the increasing speed of data transmission and system working frequency, there comes the challenges in the electrical characteristics requirement especially in signal integrity level of the IC interconnection.…”

Section: Introductionmentioning

confidence: 99%

Analysis of Transmission Performance for Fine Pitch Interconnect

Leong

Yap

Chin

et al. 2023

SSP

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Wire bonding is the preferred interconnection in the IC packaging. Understanding the electrical performance of bonding wire as transmission line is utmost important. To date, there is very limited studies on the transmission performance of fine pitch bare bonding wire especially the insulated wires. This paper investigated the transmission performance of single bare bonding wires and insulated bonding wires with different wire material, wire diameter, bonding height, insulation thickness at high frequency. The simulation analysis shows that when the frequency increases above 15Ghz, the effect of the geometric parameters has no significant different to the transmission performance. The thickness of the insulation between 0.1μm to 0.3μm reacted similar performance for return loss and insertion loss across all frequency

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“…During the bonding process, intermetallics seldom occur at the Cu-Al interface due to the low mutual diffusion rate between Cu and Al, and the bond point of Cu may have a higher durability than the Au [25,26]. Insulator coating on bare Cu conductors prevents short circuit problems of conductors and shows good joining and reliability during use, providing a potential solution for fine and ultra-fine-spacing conductor joining [27], but there are still shortcomings in high-power packaging.…”

Section: Introductionmentioning

confidence: 99%

Study on Manufacturing Technology of Ultra-Thin/Narrow Bonding Cu Strip for Electronic Packaging

Cao

Zhang

et al. 2023

Micromachines

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The performance of rolling parameters and annealing processes on the microstructure and properties of Cu strip were studied by High Precision Rolling Mill, FIB, SEM, Strength Tester, and Resistivity Tester. The results show that with the increase of the reduction rate, coarse grains in the bonding Cu strip are gradually broken and refined, and the grains are flattened when the reduction rate is 80%. The tensile strength increased from 248.0 MPa to 425.5 MPa, while the elongation decreased from 8.50% to 0.91%. The growth of lattice defects and grain boundary density results in an approximately linear increase in resistivity. With the increase of annealing temperature to 400 °C, the Cu strip recovers, and the strength decreased from 456.66 MPa to 220.36 MPa while the elongation rose from 1.09% to 24.73%. The tensile strength and elongation decreased to 192.2 MPa and 20.68%, respectively, when the annealing temperature was 550 °C. The trend of yield strength of the Cu strip was basically the same as that of tensile strength. The resistivity of the Cu strip decreased rapidly during a 200~300 °C annealing temperature, then the trend slowed, and the minimum resistivity was 3.60 × 10−8 Ω·m. The optimum tension range annealing was 6–8 g; less or more than that will affect the quality of the Cu strip.

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Characterisation of insulated Cu wire ball bonding

Cited by 3 publications

References 11 publications

Copper Wire Bonding: A Review

Copper Wire Bonding: A Review

Analysis of Transmission Performance for Fine Pitch Interconnect

Study on Manufacturing Technology of Ultra-Thin/Narrow Bonding Cu Strip for Electronic Packaging

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